Inventor · disambiguated record
Mirzafer Abatchev
Also filed as: ABATCHEV MIRZAFER · ABATCHEV MIRZAFER K
56 granted patents·8 pending applications·2,927 citations·filing 1999–2024
99Inventor score
Top patents by PatentIndex Score
64 records- 0199US7910288B2Mask material conversionMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 22, 2011·555 cites·13 claims
- 0299US7611980B2Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structuresMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 3, 2009·757 cites·18 claims
- 0399US7115525B2Method for integrated circuit fabrication using pitch multiplicationMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 3, 2006·517 cites·16 claims
- 0498US8721902B1Method and system for providing an energy assisted magnetic recording writer having a heat sink and NFTWANG ZHONGYAN·Filed 2011·Granted May 13, 2014·163 cites·20 claims
- 0598US7429536B2Methods for forming arrays of small, closely spaced featuresMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 30, 2008·98 cites·42 claims
- 0698US7253118B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 7, 2007·161 cites·52 claims
- 0797US9679781B2Methods for integrated circuit fabrication with protective coating for planarizationMICRON TECHNOLOGY INC·Filed 2015·Granted Jun 13, 2017·27 cites·10 claims
- 0897US7687408B2Method for integrated circuit fabrication using pitch multiplicationMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 30, 2010·42 cites·33 claims
- 0997US7651951B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2007·Granted Jan 26, 2010·46 cites·28 claims
- 1097US7547640B2Method for integrated circuit fabrication using pitch multiplicationMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 16, 2009·49 cites·39 claims
- 1197US7393789B2Protective coating for planarizationMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 1, 2008·110 cites·39 claims
- 1296US8557704B2Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structuresWELLS DAVID H·Filed 2009·Granted Oct 15, 2013·31 cites·19 claims
- 1395US9761457B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·7 cites·8 claims
- 1495US8883644B2Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structuresMICRON TECHNOLOGY INC·Filed 2013·Granted Nov 11, 2014·15 cites·20 claims
- 1595US8852851B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameZHOU BAOSUO·Filed 2006·Granted Oct 7, 2014·23 cites·10 claims
- 1695US7718540B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2007·Granted May 18, 2010·22 cites·5 claims
- 1795US7629693B2Method for integrated circuit fabrication using pitch multiplicationMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 8, 2009·20 cites·14 claims
- 1894US10096483B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 9, 2018·6 cites·8 claims
- 1994US9478497B2Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structuresMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 25, 2016·11 cites·7 claims
- 2094US8048812B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2010·Granted Nov 1, 2011·11 cites·20 claims
- 2193US10446394B2Spacer profile control using atomic layer deposition in a multiple patterning processLAM RES CORP·Filed 2018·Granted Oct 15, 2019·8 cites·22 claims
- 2293US8207576B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2007·Granted Jun 26, 2012·18 cites·25 claims
- 2392US10607844B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 31, 2020·4 cites·4 claims
- 2492US9003651B2Methods for integrated circuit fabrication with protective coating for planarizationMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 14, 2015·9 cites·20 claims
- 2592US8598632B2Integrated circuit having pitch reduced patterns relative to photoithography featuresTRAN LUAN·Filed 2012·Granted Dec 3, 2013·10 cites·6 claims
- 2691US8216949B2Method for integrated circuit fabrication using pitch multiplicationABATCHEV MIRZAFER K·Filed 2010·Granted Jul 10, 2012·10 cites·18 claims
- 2790US12463044B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Nov 4, 2025·0 cites·12 claims
- 2890US7662718B2Trim process for critical dimension control for integrated circuitsMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 16, 2010·14 cites·23 claims
- 2990US7662299B2Nanoimprint lithography template techniques for use during the fabrication of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 16, 2010·9 cites·6 claims
- 3090US7547599B2Multi-state memory cellMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 16, 2009·16 cites·25 claims
- 3188US8834728B1Method and system for providing an energy assisted magnetic recording writer having a self aligned heat sink and NFTHU YUFENG·Filed 2011·Granted Sep 16, 2014·10 cites·18 claims
- 3288US8207614B2Methods for forming arrays of small, closely spaced featuresABATCHEV MIRZAFER·Filed 2008·Granted Jun 26, 2012·10 cites·15 claims
- 3388US8119535B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2009·Granted Feb 21, 2012·8 cites·19 claims
- 3488US7563723B2Critical dimension control for integrated circuitsMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 21, 2009·11 cites·18 claims
- 3587US8479384B2Methods for integrated circuit fabrication with protective coating for planarizationABATCHEV MIRZAFER·Filed 2011·Granted Jul 9, 2013·6 cites·20 claims
- 3687US7910483B2Trim process for critical dimension control for integrated circuitsMICRON TECHNOLOGY INC·Filed 2010·Granted Mar 22, 2011·7 cites·18 claims
- 3783US9305782B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 5, 2016·3 cites·10 claims
- 3883US6716758B1Aspect ratio controlled etch selectivity using time modulated DC bias voltageMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 6, 2004·52 cites·37 claims
- 3982US11935756B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Mar 19, 2024·0 cites·8 claims
- 4082US9941123B1Post etch treatment to prevent pattern collapseLAM RES CORP·Filed 2017·Granted Apr 10, 2018·3 cites·18 claims
- 4182US9099402B2Integrated circuit structure having arrays of small, closely spaced featuresABATCHEV MIRZAFER·Filed 2012·Granted Aug 4, 2015·4 cites·19 claims
- 4281US8486610B2Mask material conversionABATCHEV MIRZAFER K·Filed 2011·Granted Jul 16, 2013·4 cites·21 claims
- 4378US7271106B2Critical dimension control for integrated circuitsMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 18, 2007·17 cites·28 claims
- 4475US8183138B2Methods for forming nanodots and/or a patterned material during the formation of a semiconductor deviceSUBRAMANIAN KRUPAKAR M·Filed 2010·Granted May 22, 2012·2 cites·13 claims
- 4575US7857982B2Methods of etching features into substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 28, 2010·5 cites·20 claims
- 4674US11335563B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 17, 2022·0 cites·7 claims
- 4774US9117767B2Negative ion control for dielectric etchMARAKHATANOV ALEXEI·Filed 2011·Granted Aug 25, 2015·3 cites·16 claims
- 4872US8011090B2Method for forming and planarizing adjacent regions of an integrated circuitMICRON TECHNOLOGY INC·Filed 2008·Granted Sep 6, 2011·2 cites·16 claims
- 4969US10181412B2Negative ion control for dielectric etchLAM RES CORP·Filed 2015·Granted Jan 15, 2019·1 cites·16 claims
- 5068US9267605B2Pressure control valve assembly of plasma processing chamber and rapid alternating processABATCHEV MIRZAFER·Filed 2011·Granted Feb 23, 2016·2 cites·18 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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