Inventor · disambiguated record
Steven S. Nasiri
Also filed as: NASIRI STEVEN · NASIRI STEVEN S · NASIRI STEVEN SAEED
58 granted patents·15 pending applications·3,615 citations·filing 1997–2022
99Inventor score
Top patents by PatentIndex Score
73 records- 0199US7442570B2Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefromINVENSENSE INC·Filed 2005·Granted Oct 28, 2008·220 cites·10 claims
- 0299US7258011B2Multiple axis accelerometerINVENSENSE INC·Filed 2005·Granted Aug 21, 2007·151 cites·50 claims
- 0399US7250353B2Method and system of releasing a MEMS structureINVENSENSE INC·Filed 2005·Granted Jul 31, 2007·135 cites·8 claims
- 0499US7104129B2Vertically integrated MEMS structure with electronics in a hermetically sealed cavityINVENSENSE INC·Filed 2004·Granted Sep 12, 2006·229 cites·18 claims
- 0599US6892575B2X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packagingINVENSENSE INC·Filed 2003·Granted May 17, 2005·172 cites·49 claims
- 0698US9902611B2Miniaturized and ruggedized wafer level MEMs force sensorsNEXTINPUT INC·Filed 2015·Granted Feb 27, 2018·20 cites·13 claims
- 0798US8960002B2Vertically integrated 3-axis MEMS angular accelerometer with integrated electronicsNASIRI STEVEN S·Filed 2011·Granted Feb 24, 2015·41 cites·20 claims
- 0898US8513747B1Integrated MEMS devices with controlled pressure environments by means of enclosed volumesINVENSENSE INC·Filed 2012·Granted Aug 20, 2013·44 cites·14 claims
- 0998US8350346B1Integrated MEMS devices with controlled pressure environments by means of enclosed volumesINVENSENSE INC·Filed 2012·Granted Jan 8, 2013·101 cites·22 claims
- 1098US8351773B2Motion sensing and processing on mobile devicesINVENSENSE INC·Filed 2011·Granted Jan 8, 2013·93 cites·22 claims
- 1198US8250921B2Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronicsNASIRI STEVEN S·Filed 2007·Granted Aug 28, 2012·185 cites·22 claims
- 1298US7907838B2Motion sensing and processing on mobile devicesINVENSENSE INC·Filed 2010·Granted Mar 15, 2011·123 cites·20 claims
- 1398US7250112B2Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packagingINVENSENSE INC·Filed 2005·Granted Jul 31, 2007·91 cites·42 claims
- 1497US8047075B2Vertically integrated 3-axis MEMS accelerometer with electronicsINVENSENSE INC·Filed 2007·Granted Nov 1, 2011·69 cites·22 claims
- 1597US7934423B2Vertically integrated 3-axis MEMS angular accelerometer with integrated electronicsINVENSENSE INC·Filed 2007·Granted May 3, 2011·53 cites·21 claims
- 1697US7458263B2Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packagingINVENSENSE INC·Filed 2005·Granted Dec 2, 2008·88 cites·27 claims
- 1797US6480320B2Microelectromechanical mirror and mirror arrayTRANSPARENT OPTICAL INC·Filed 2001·Granted Nov 12, 2002·168 cites·76 claims
- 1897US6351996B1Hermetic packaging for semiconductor pressure sensorsMAXIM INTEGRATED PRODUCTS·Filed 1998·Granted Mar 5, 2002·144 cites·37 claims
- 1996US7621183B2X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packagingINVENSENSE INC·Filed 2008·Granted Nov 24, 2009·66 cites·18 claims
- 2096US7247246B2Vertical integration of a MEMS structure with electronics in a hermetically sealed cavityINVENSENSE INC·Filed 2004·Granted Jul 24, 2007·141 cites·19 claims
- 2196US6939473B2Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packagingINVENSENSE INC·Filed 2003·Granted Sep 6, 2005·139 cites·41 claims
- 2295US8997564B2Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronicsNASIRI STEVEN S·Filed 2012·Granted Apr 7, 2015·14 cites·35 claims
- 2395US8084332B2Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefromNASIRI STEVEN S·Filed 2008·Granted Dec 27, 2011·23 cites·28 claims
- 2495US7796872B2Method and apparatus for producing a sharp image from a handheld device containing a gyroscopeINVENSENSE INC·Filed 2007·Granted Sep 14, 2010·67 cites·21 claims
- 2595US7677099B2Integrated microelectromechanical systems (MEMS) vibrating mass Z-axis rate sensorINVENSENSE INC·Filed 2007·Granted Mar 16, 2010·78 cites·28 claims
- 2695US6533947B2Microelectromechanical mirror and mirror arrayTRANSPARENT OPTICAL INC·Filed 2001·Granted Mar 18, 2003·137 cites·65 claims
- 2795US6255728B1Rigid encapsulation package for semiconductor devicesMAXIM INTEGRATED PRODUCTS·Filed 1999·Granted Jul 3, 2001·114 cites·44 claims
- 2895US6229190B1Compensated semiconductor pressure sensorMAXIM INTEGRATED PRODUCTS·Filed 1998·Granted May 8, 2001·201 cites·47 claims
- 2994US9292102B2Controlling and accessing content using motion processing on mobile devicesINVENSENSE INC·Filed 2013·Granted Mar 22, 2016·20 cites·15 claims
- 3094US8952832B2Interfacing application programs and motion sensors of a deviceNASIRI STEVEN S·Filed 2008·Granted Feb 10, 2015·32 cites·28 claims
- 3194US8633049B2Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefromNASIRI STEVEN S·Filed 2011·Granted Jan 21, 2014·8 cites·19 claims
- 3294US8462109B2Controlling and accessing content using motion processing on mobile devicesNASIRI STEVEN S·Filed 2009·Granted Jun 11, 2013·30 cites·12 claims
- 3394US6346742B1Chip-scale packaged pressure sensorMAXIM INTEGRATED PRODUCTS·Filed 1998·Granted Feb 12, 2002·97 cites·82 claims
- 3493US8069726B2X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packagingSEEGER JOSEPH·Filed 2009·Granted Dec 6, 2011·38 cites·32 claims
- 3592US8508039B1Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronicsNASIRI STEVEN S·Filed 2008·Granted Aug 13, 2013·26 cites·21 claims
- 3692US8384134B2MEMS device including an electrical interconnect through a substrateINVENSENSE INC·Filed 2012·Granted Feb 26, 2013·11 cites·18 claims
- 3792US6006607APiezoresistive pressure sensor with sculpted diaphragmMAXIM INTEGRATED PRODUCTS·Filed 1998·Granted Dec 28, 1999·93 cites·30 claims
- 3890US9342154B2Interfacing application programs and motion sensors of a deviceINVENSENSE INC·Filed 2015·Granted May 17, 2016·4 cites·24 claims
- 3989US8170408B2Optical image stabilization in a digital still camera or handsetNASIRI STEVEN S·Filed 2010·Granted May 1, 2012·9 cites·22 claims
- 4085US10466119B2Ruggedized wafer level MEMS force sensor with a tolerance trenchNEXTINPUT INC·Filed 2016·Granted Nov 5, 2019·4 cites·12 claims
- 4185US6898341B2Optical system for calibration and control of an optical fiber switchINTEL CORP·Filed 2001·Granted May 24, 2005·24 cites·12 claims
- 4283US6922500B2Optical configuration for optical fiber switchINTEL CORP·Filed 2001·Granted Jul 26, 2005·23 cites·36 claims
- 4381US6823127B2Apparatus for holding a fiber arrayINTEL CORP·Filed 2002·Granted Nov 23, 2004·24 cites·23 claims
- 4476US10288427B2Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronicsINVENSENSE INC·Filed 2015·Granted May 14, 2019·1 cites·17 claims
- 4576US9811174B2Interfacing application programs and motion sensors of a deviceINVENSENSE INC·Filed 2015·Granted Nov 7, 2017·2 cites·21 claims
- 4672US5880372AMedia compatible pressure sensor device utilizing self-aligned components which fit together without the need for adhesivesINTEGRATED SENSOR SOLUTIONS·Filed 1997·Granted Mar 9, 1999·31 cites·3 claims
- 4771US7076146B2Variable optical attenuatorINTEL CORP·Filed 2004·Granted Jul 11, 2006·11 cites·9 claims
- 4870US11930321B1Integrated MEMS micro-speaker device and methodVIBRANT MICROSYSTEMS INC·Filed 2022·Granted Mar 12, 2024·0 cites·25 claims
- 4970US6980712B2Optical system for calibration and control of an optical fiber switchINTEL CORP·Filed 2004·Granted Dec 27, 2005·7 cites·12 claims
- 5069US2019226848A1Integrated motion processing unit (mpu) with mems inertial sensing and embedded digital electronicsINVENSENSE INC·Filed 2019·Application pending·0 cites
Showing the top 50 of 73 patent records by PatentIndex Score.
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