Inventor · disambiguated record
Bruce Carlton Roberts
Also filed as: ROBERTS BRUCE C · ROBERTS BRUCE CARLTON
23 granted patents·287 citations·filing 2001–2006
96Inventor score
Files withNAT SEMICONDUCTOR CORP23
Top patents by PatentIndex Score
23 records- 0188US6624507B1Miniature semiconductor package for opto-electronic devicesNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 23, 2003·50 cites·19 claims
- 0285US6802654B1Electrical connector for opto-electronic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Oct 12, 2004·33 cites·21 claims
- 0385US6595699B1Optoelectronic package with controlled fiber standoffNAT SEMICONDUCTOR CORP·Filed 2001·Granted Jul 22, 2003·40 cites·25 claims
- 0484US6749345B1Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boardsNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jun 15, 2004·28 cites·30 claims
- 0582US6655854B1Optoelectronic package with dam structure to provide fiber standoffNAT SEMICONDUCTOR CORP·Filed 2001·Granted Dec 2, 2003·31 cites·34 claims
- 0678US6642613B1Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2001·Granted Nov 4, 2003·13 cites·22 claims
- 0774US6830382B1Miniature form-factor connecter for fiber optic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Dec 14, 2004·15 cites·19 claims
- 0874US6767140B2Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technologyNAT SEMICONDUCTOR CORP·Filed 2003·Granted Jul 27, 2004·15 cites·34 claims
- 0973US7086788B2Optical sub-assembly for opto-electronic modulesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Aug 8, 2006·5 cites·18 claims
- 1067US6628000B1Techniques for maintaining parallelism between optical and chip sub-assembliesNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 30, 2003·10 cites·29 claims
- 1165US6916121B2Optical sub-assembly for optoelectronic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jul 12, 2005·11 cites·32 claims
- 1264US7195955B2Technique for protecting photonic devices in optoelectronic packages with clear overmoldingNAT SEMICONDUCTOR CORP·Filed 2005·Granted Mar 27, 2007·2 cites·6 claims
- 1361US7247942B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Jul 24, 2007·5 cites·20 claims
- 1458US6858468B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2003·Granted Feb 22, 2005·4 cites·14 claims
- 1557US7001083B1Technique for protecting photonic devices in optoelectronic packages with clear overmoldingNAT SEMICONDUCTOR CORP·Filed 2001·Granted Feb 21, 2006·6 cites·27 claims
- 1657US6973225B2Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic packageNAT SEMICONDUCTOR CORP·Filed 2002·Granted Dec 6, 2005·8 cites·19 claims
- 1755US7023705B2Ceramic optical sub-assembly for optoelectronic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Apr 4, 2006·5 cites·12 claims
- 1854US7199440B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Apr 3, 2007·2 cites·20 claims
- 1952US6838317B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2003·Granted Jan 4, 2005·2 cites·22 claims
- 2049US6765275B1Two-layer electrical substrate for optical devicesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jul 20, 2004·2 cites·18 claims
- 2143US7432575B2Two-layer electrical substrate for optical devicesNAT SEMICONDUCTOR CORP·Filed 2004·Granted Oct 7, 2008·0 cites·10 claims
- 2243US7269027B2Ceramic optical sub-assembly for optoelectronic modulesNAT SEMICONDUCTOR CORP·Filed 2006·Granted Sep 11, 2007·0 cites·20 claims
- 2341US7086786B2Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technologyNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 8, 2006·0 cites·10 claims
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