Inventor · disambiguated record
Nathan W. Cheung
Also filed as: CHEUNG NATHAN · CHEUNG NATHAN W
64 granted patents·13 pending applications·9,765 citations·filing 1997–2014
99Inventor score
Top patents by PatentIndex Score
77 records- 0199US7371660B2Controlled cleaving processSILICON GENESIS CORP·Filed 2005·Granted May 13, 2008·289 cites·56 claims
- 0299US6790747B2Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2002·Granted Sep 14, 2004·239 cites·24 claims
- 0399US6632724B2Controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Oct 14, 2003·163 cites·31 claims
- 0499US6528391B1Controlled cleavage process and device for patterned filmsSILICON GENESIS CORP·Filed 1999·Granted Mar 4, 2003·422 cites·22 claims
- 0599US6420242B1Separation of thin films from transparent substrates by selective optical processingUNIV CALIFORNIA·Filed 2000·Granted Jul 16, 2002·447 cites·9 claims
- 0699US6146979APressurized microbubble thin film separation process using a reusable substrateSILICON GENESIS CORP·Filed 1998·Granted Nov 14, 2000·292 cites·10 claims
- 0799US6071795ASeparation of thin films from transparent substrates by selective optical processingUNIV CALIFORNIA·Filed 1998·Granted Jun 6, 2000·1.2k cites·25 claims
- 0899US6048411ASilicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 1998·Granted Apr 11, 2000·266 cites·11 claims
- 0999US6033974AMethod for controlled cleaving processSILICON GENESIS CORP·Filed 1999·Granted Mar 7, 2000·386 cites·20 claims
- 1099US6013563AControlled cleaning processSILICON GENESIS CORP·Filed 1998·Granted Jan 11, 2000·330 cites·48 claims
- 1199US6010579AReusable substrate for thin film separationSILICON GENESIS CORP·Filed 1998·Granted Jan 4, 2000·254 cites·15 claims
- 1299US5985742AControlled cleavage process and device for patterned filmsSILICON GENESIS CORP·Filed 1998·Granted Nov 16, 1999·493 cites·22 claims
- 1398US6548382B1Gettering technique for wafers made using a controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Apr 15, 2003·162 cites·20 claims
- 1498US6458672B1Controlled cleavage process and resulting device using beta annealingSILICON GENESIS CORP·Filed 2000·Granted Oct 1, 2002·84 cites·56 claims
- 1598US6391740B1Generic layer transfer methodology by controlled cleavage processSILICON GENESIS CORP·Filed 1999·Granted May 21, 2002·163 cites·20 claims
- 1698US6335263B1Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materialsUNIV CALIFORNIA·Filed 2000·Granted Jan 1, 2002·302 cites·31 claims
- 1798US6321134B1Clustertool system software using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Nov 20, 2001·357 cites·23 claims
- 1898US6184111B1Pre-semiconductor process implant and post-process film separationSILICON GENESIS CORP·Filed 1999·Granted Feb 6, 2001·251 cites·7 claims
- 1998US6159824ASilicon-on-silicon wafer bonding process using a thin film blister-separation methodSILICON GENESIS CORP·Filed 1998·Granted Dec 12, 2000·188 cites·8 claims
- 2098US6013567AControlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1999·Granted Jan 11, 2000·154 cites·4 claims
- 2198US5994207AControlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1998·Granted Nov 30, 1999·244 cites·24 claims
- 2297US7160790B2Controlled cleaving processSILICON GENESIS CORP·Filed 2003·Granted Jan 9, 2007·70 cites·39 claims
- 2397US6511899B1Controlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1999·Granted Jan 28, 2003·133 cites·11 claims
- 2497US6486041B2Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2001·Granted Nov 26, 2002·124 cites·20 claims
- 2597US6290804B1Controlled cleavage process using patterningSILICON GENESIS CORP·Filed 1998·Granted Sep 18, 2001·121 cites·67 claims
- 2697US6245161B1Economical silicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 1998·Granted Jun 12, 2001·127 cites·20 claims
- 2797US6207005B1Cluster tool apparatus using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Mar 27, 2001·209 cites·18 claims
- 2897US6187110B1Device for patterned filmsSILICON GENESIS CORP·Filed 1999·Granted Feb 13, 2001·123 cites·1 claims
- 2997US6083324AGettering technique for silicon-on-insulator wafersSILICON GENESIS CORP·Filed 1998·Granted Jul 4, 2000·252 cites·26 claims
- 3096US6558802B1Silicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 2000·Granted May 6, 2003·59 cites·18 claims
- 3196US6534381B2Method for fabricating multi-layered substratesSILICON GENESIS CORP·Filed 2000·Granted Mar 18, 2003·139 cites·25 claims
- 3296US6335264B1Controlled cleavage thin film separation process using a reusable substrateSILICON GENESIS CORP·Filed 2000·Granted Jan 1, 2002·60 cites·17 claims
- 3396US6284631B1Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Sep 4, 2001·86 cites·17 claims
- 3496US6162705AControlled cleavage process and resulting device using beta annealingSILICON GENESIS CORP·Filed 1998·Granted Dec 19, 2000·113 cites·52 claims
- 3596US6153524ACluster tool method using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Nov 28, 2000·150 cites·73 claims
- 3695US6890838B2Gettering technique for wafers made using a controlled cleaving processSILICON GENESIS CORP·Filed 2003·Granted May 10, 2005·71 cites·20 claims
- 3795US6582999B2Controlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 2001·Granted Jun 24, 2003·109 cites·25 claims
- 3895US6155909AControlled cleavage system using pressurized fluidSILICON GENESIS CORP·Filed 1998·Granted Dec 5, 2000·80 cites·28 claims
- 3995US6103599APlanarizing technique for multilayered substratesSILICON GENESIS CORP·Filed 1998·Granted Aug 15, 2000·206 cites·28 claims
- 4095US6027988AMethod of separating films from bulk substrates by plasma immersion ion implantationUNIV CALIFORNIA·Filed 1997·Granted Feb 22, 2000·156 cites·54 claims
- 4194US6159825AControlled cleavage thin film separation process using a reusable substrateSILICON GENESIS CORP·Filed 1998·Granted Dec 12, 2000·74 cites·17 claims
- 4293US7410887B2Controlled process and resulting deviceSILICON GENESIS CORP·Filed 2007·Granted Aug 12, 2008·11 cites·44 claims
- 4393US7348258B2Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2004·Granted Mar 25, 2008·55 cites·12 claims
- 4492US6294814B1Cleaved silicon thin film with rough surfaceSILICON GENESIS CORP·Filed 1999·Granted Sep 25, 2001·54 cites·6 claims
- 4592US6291313B1Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 1999·Granted Sep 18, 2001·137 cites·27 claims
- 4691US7470600B2Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2007·Granted Dec 30, 2008·14 cites·20 claims
- 4789US8012852B2Controlled process and resulting deviceSILICON GENESIS CORP·Filed 2010·Granted Sep 6, 2011·4 cites·21 claims
- 4889US7221455B2Integrated, fluorescence-detecting microanalytical systemUNVERSITY OF CALIFORNIA·Filed 2004·Granted May 22, 2007·51 cites·20 claims
- 4989US6265328B1Wafer edge engineering method and deviceSILICON GENESIS CORP·Filed 1999·Granted Jul 24, 2001·124 cites·17 claims
- 5085US7846818B2Controlled process and resulting deviceSILICON GENESIS CORP·Filed 2008·Granted Dec 7, 2010·4 cites·47 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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