Inventor · disambiguated record
Ronald J. Schutz
Also filed as: SCHUTZ RONALD J · SCHUTZ RONALD JOSEPH
19 granted patents·2 pending applications·342 citations·filing 1984–2012
95Inventor score
Files withAT & T BELL LAB6INFINEON TECHNOLOGIES AG4AMERICAN TELEPHONE & TELEGRAPH3IBM2LIFSHITZ NADIA1
Top patents by PatentIndex Score
21 records- 0190US4680084AInterferometric methods and apparatus for device fabricationAMERICAN TELEPHONE & TELEGRAPH·Filed 1984·Granted Jul 14, 1987·48 cites·15 claims
- 0282US6136714AMethods for enhancing the metal removal rate during the chemical-mechanical polishing process of a semiconductorSIEMENS AG·Filed 1998·Granted Oct 24, 2000·66 cites·11 claims
- 0379US6841480B2Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 11, 2005·20 cites·75 claims
- 0474US7011574B2Polyelectrolyte dispensing polishing padINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 14, 2006·13 cites·20 claims
- 0568US5057441AMethod for reliability testing integrated circuit metal filmsAT & T BELL LAB·Filed 1990·Granted Oct 15, 1991·51 cites·5 claims
- 0657US5243221AAluminum metallization doped with iron and copper to prevent electromigrationAT & T BELL LAB·Filed 1993·Granted Sep 7, 1993·25 cites·3 claims
- 0755US6420267B1Method for forming an integrated barrier/plug for a stacked capacitorINFINEON TECHNOLOGIES AG·Filed 2000·Granted Jul 16, 2002·5 cites·8 claims
- 0852US5008217AProcess for fabricating integrated circuits having shallow junctionsAT & T BELL LAB·Filed 1990·Granted Apr 16, 1991·23 cites·6 claims
- 0951US6303506B1Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP processINFINEON TECHNOLOGIES AG·Filed 1999·Granted Oct 16, 2001·16 cites·17 claims
- 1051US4784719ADry etching procedureAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Nov 15, 1988·18 cites·12 claims
- 1149US4975389AAluminum metallization for semiconductor devicesAT & T BELL LAB·Filed 1989·Granted Dec 4, 1990·15 cites·3 claims
- 1243US6037648ASemiconductor structure including a conductive fuse and process for fabrication thereofIBM·Filed 1998·Granted Mar 14, 2000·14 cites·9 claims
- 1340US9016880B2Optical device with two cylindrically symmetric mirrorsSCHUTZ RONALD JOSEPH·Filed 2012·Granted Apr 28, 2015·0 cites·15 claims
- 1438US6358850B1Slurry-less chemical-mechanical polishing of oxide materialsIBM·Filed 1999·Granted Mar 19, 2002·7 cites·18 claims
- 1538US2006001162A1Nitride and polysilicon interface with titanium layerSCHUTZ RONALD J·Filed 2005·Application pending·0 cites
- 1637US5693561AMethod of integrated circuit fabrication including a step of depositing tungstenLUCENT TECHNOLOGIES INC·Filed 1996·Granted Dec 2, 1997·6 cites·6 claims
- 1733US4871420ASelective etching processAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Oct 3, 1989·6 cites·7 claims
- 1829US5166091AFabrication method in vertical integrationAT & T BELL LAB·Filed 1991·Granted Nov 24, 1992·3 cites·6 claims
- 1929US4988405AFabrication of devices utilizing a wet etchback procedureAT & T BELL LAB·Filed 1989·Granted Jan 29, 1991·2 cites·6 claims
- 2029US2002016050A1Heat-up time reduction before metal depositionFiled 1999·Application pending·0 cites
- 2125US5149672AProcess for fabricating integrated circuits having shallow junctionsLIFSHITZ NADIA·Filed 1991·Granted Sep 22, 1992·4 cites·6 claims
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