Inventor · disambiguated record
Tomoko Higashiuchi
Also filed as: HIGASHIUCHI Tomoko
19 granted patents·8 pending applications·27 citations·filing 2013–2024
90Inventor score
Top patents by PatentIndex Score
27 records- 0191US11015020B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2016·Granted May 25, 2021·3 cites·8 claims
- 0291US10920010B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Feb 16, 2021·3 cites·9 claims
- 0391US10597485B2Production methods for glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, storage methods for liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, and production method for cured epoxy resinHITACHI CHEMICAL CO LTD·Filed 2017·Granted Mar 24, 2020·5 cites·15 claims
- 0488US11466119B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Oct 11, 2022·2 cites·14 claims
- 0588US10800872B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialHITACHI CHEMICAL CO LTD·Filed 2017·Granted Oct 13, 2020·2 cites·10 claims
- 0688US2024417509A1Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicleRESONAC CORP·Filed 2024·Application pending·0 cites
- 0787US12104009B2Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicleRESONAC CORP·Filed 2018·Granted Oct 1, 2024·1 cites·7 claims
- 0887US11440990B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Sep 13, 2022·2 cites·13 claims
- 0978US9334573B2Layered silicate silver surface treatment agent, sulfidation prevention film and light-emitting device with treated silver layerHITACHI CHEMICAL CO LTD·Filed 2013·Granted May 10, 2016·5 cites·5 claims
- 1076US9525114B2Optical semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Dec 20, 2016·4 cites·6 claims
- 1166US12049538B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Jul 30, 2024·0 cites·12 claims
- 1261US2025282116A1Sheet comprising thermal insulation layer and adhesive layerRESONAC CORP·Filed 2023·Application pending·0 cites
- 1359US11661475B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted May 30, 2023·0 cites·9 claims
- 1459US11352562B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·7 claims
- 1559US2024043648A1Composition and sheet containing cured product of sameRESONAC CORP·Filed 2021·Application pending·0 cites
- 1659US2024043597A1Composition and sheetRESONAC CORP·Filed 2021·Application pending·0 cites
- 1756US10646851B2Separation materialHITACHI CHEMICAL CO LTD·Filed 2016·Granted May 12, 2020·0 cites·9 claims
- 1855US11919995B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialRESONAC CORP·Filed 2019·Granted Mar 5, 2024·0 cites·14 claims
- 1954US2025282980A1Sheet provided with heat insulating layer and adhesive layerRESONAC CORP·Filed 2023·Application pending·0 cites
- 2052US11840600B2Cured epoxy resin material, epoxy resin composition, molded article, and composite materialHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 12, 2023·0 cites·7 claims
- 2152US11560476B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Jan 24, 2023·0 cites·6 claims
- 2249US2024047230A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 2348US11535700B2Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturingSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Dec 27, 2022·0 cites·21 claims
- 2448US10875008B2Separation materialHITACHI CHEMICAL CO LTD·Filed 2016·Granted Dec 29, 2020·0 cites·18 claims
- 2546US2020262969A1Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2645US9634210B2Optical semiconductor device production method and optical semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Apr 25, 2017·0 cites·6 claims
- 2740US2015175811A1Silver-sulfidation-preventing material and method for forming silver-sulfidation-preventing film, and method for producing light-emitting device and light-emitting deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
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