Inventor · disambiguated record
Ryuji Sugiura
Also filed as: SUGIURA RYUJI
21 granted patents·3 pending applications·594 citations·filing 2003–2023
95Inventor score
Top patents by PatentIndex Score
24 records- 0198US8143141B2Laser beam machining method and semiconductor chipSUGIURA RYUJI·Filed 2010·Granted Mar 27, 2012·44 cites·9 claims
- 0298US7939430B2Laser processing methodHAMAMATSU PHOTONICS KK·Filed 2005·Granted May 10, 2011·132 cites·7 claims
- 0398US7902636B2Semiconductor chip including a substrate and multilayer partHAMAMATSU PHOTONICS KK·Filed 2005·Granted Mar 8, 2011·127 cites·2 claims
- 0498US7897487B2Laser processing method and chipHAMAMATSU PHOTONICS KK·Filed 2007·Granted Mar 1, 2011·132 cites·17 claims
- 0596US8058103B2Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2009·Granted Nov 15, 2011·34 cites·8 claims
- 0693US9035216B2Method and device for controlling interior fractures by controlling the laser pulse widthSUGIURA RYUJI·Filed 2010·Granted May 19, 2015·16 cites·12 claims
- 0791US9076855B2Laser machining methodSUGIURA RYUJI·Filed 2010·Granted Jul 7, 2015·14 cites·8 claims
- 0890US8263479B2Method for cutting semiconductor substrateFUKUYO FUMITSUGU·Filed 2003·Granted Sep 11, 2012·44 cites·39 claims
- 0988US8338271B2Laser processing method and chipSUGIURA RYUJI·Filed 2011·Granted Dec 25, 2012·7 cites·15 claims
- 1087US8450187B2Method of cutting semiconductor substrateFUKUYO FUMITSUGU·Filed 2012·Granted May 28, 2013·6 cites·12 claims
- 1186US8551817B2Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2011·Granted Oct 8, 2013·6 cites·12 claims
- 1286US8513567B2Laser processing method for forming a modified region for cutting in an objectOSAJIMA TETSUYA·Filed 2006·Granted Aug 20, 2013·17 cites·11 claims
- 1386US8043941B2Laser processing method and chipHAMAMATSU PHOTONICS KK·Filed 2010·Granted Oct 25, 2011·6 cites·16 claims
- 1484US11211250B2Laminated element manufacturing methodHAMAMATSU PHOTONICS KK·Filed 2018·Granted Dec 28, 2021·3 cites·7 claims
- 1579US8865566B2Method of cutting semiconductor substrateHAMAMATSU PHOTONICS KK·Filed 2013·Granted Oct 21, 2014·3 cites·12 claims
- 1678US8409968B2Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansionFUKUYO FUMITSUGU·Filed 2011·Granted Apr 2, 2013·3 cites·1 claims
- 1765US11817319B2Laminated element manufacturing methodHAMAMATSU PHOTONICS KK·Filed 2021·Granted Nov 14, 2023·0 cites·7 claims
- 1853US12334339B2Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Granted Jun 17, 2025·0 cites·9 claims
- 1953US2023230829A1Semiconductor wafer processing apparatus and method of manufacturing semiconductor elementDENSO CORP·Filed 2022·Application pending·0 cites
- 2046US9409256B2Laser processing methodSUGIURA RYUJI·Filed 2011·Granted Aug 9, 2016·0 cites·16 claims
- 2144US2007085099A1Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2004·Application pending·0 cites
- 2243US11069672B2Laminated element manufacturing methodHAMAMATSU PHOTONICS KK·Filed 2018·Granted Jul 20, 2021·0 cites·5 claims
- 2341US11158601B2Laminated element manufacturing methodHAMAMATSU PHOTONICS KK·Filed 2018·Granted Oct 26, 2021·0 cites·8 claims
- 2435US2007252154A1Semiconductor Chip Manufacturing Method, Semiconductor Chip, Semiconductor Thin Film Chip, Electron Tube and Photo-Detecting DeviceUCHIYAMA SHOICHI·Filed 2004·Application pending·0 cites
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