Inventor · disambiguated record
Shyng-Tsong Chen
Also filed as: CHEN SHYNG-TSONG · CHEN SHYNG-TSONG T
59 granted patents·12 pending applications·1,009 citations·filing 2000–2021
99Inventor score
Top patents by PatentIndex Score
71 records- 0199US6685548B2Grooved polishing pads and methods of useIBM·Filed 2003·Granted Feb 3, 2004·137 cites·13 claims
- 0296US7190079B2Selective capping of copper wiringIBM·Filed 2005·Granted Mar 13, 2007·39 cites·9 claims
- 0396US7008871B2Selective capping of copper wiringIBM·Filed 2003·Granted Mar 7, 2006·105 cites·23 claims
- 0495US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 0594US10157789B2Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2016·Granted Dec 18, 2018·12 cites·11 claims
- 0694US7745324B1Interconnect with recessed dielectric adjacent a noble metal capIBM·Filed 2009·Granted Jun 29, 2010·24 cites·18 claims
- 0794US6383066B1Multilayered polishing pad, method for fabricating, and use thereofIBM·Filed 2000·Granted May 7, 2002·91 cites·14 claims
- 0893US9490168B1Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2015·Granted Nov 8, 2016·10 cites·9 claims
- 0993US7514361B2Selective thin metal cap processIBM·Filed 2007·Granted Apr 7, 2009·28 cites·6 claims
- 1093US6656019B1Grooved polishing pads and methods of useIBM·Filed 2000·Granted Dec 2, 2003·63 cites·10 claims
- 1192US9224686B1Single damascene interconnect structureIBM·Filed 2014·Granted Dec 29, 2015·11 cites·15 claims
- 1292US8835305B2Method of fabricating a profile control in interconnect structuresYANG CHIH-CHAO·Filed 2012·Granted Sep 16, 2014·12 cites·13 claims
- 1392US7314786B1Metal resistor, resistor material and methodIBM·Filed 2006·Granted Jan 1, 2008·18 cites·5 claims
- 1492US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 1590US7709344B2Integrated circuit fabrication process using gas cluster ion beam etchingIBM·Filed 2005·Granted May 4, 2010·16 cites·15 claims
- 1689US10361367B1Resistive memory crossbar array with top electrode inner spacersIBM·Filed 2018·Granted Jul 23, 2019·4 cites·17 claims
- 1789US7838428B2Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular speciesIBM·Filed 2006·Granted Nov 23, 2010·16 cites·10 claims
- 1889US7666753B2Metal capping process for BEOL interconnect with air gapsIBM·Filed 2007·Granted Feb 23, 2010·18 cites·1 claims
- 1989US7186166B2Fiber embedded polishing padFREUDENBERG NONWOVENS LTD·Filed 2005·Granted Mar 6, 2007·13 cites·5 claims
- 2088US7892968B2Via gouging methods and related semiconductor structureIBM·Filed 2008·Granted Feb 22, 2011·12 cites·18 claims
- 2186US10672980B2Resistive memory crossbar array with top electrode inner spacersIBM·Filed 2019·Granted Jun 2, 2020·3 cites·20 claims
- 2285US10381563B1Resistive memory crossbar array compatible with Cu metallizationIBM·Filed 2018·Granted Aug 13, 2019·4 cites·20 claims
- 2385US7816253B2Surface treatment of inter-layer dielectricIBM·Filed 2006·Granted Oct 19, 2010·10 cites·6 claims
- 2484US8835326B2Titanium-nitride removalFITZSIMMONS JOHN A·Filed 2012·Granted Sep 16, 2014·6 cites·22 claims
- 2584US8399350B2Formation of air gap with protection of metal linesNOGAMI TAKESHI·Filed 2010·Granted Mar 19, 2013·6 cites·16 claims
- 2684US7358182B2Method of forming an interconnect structureIBM·Filed 2005·Granted Apr 15, 2008·11 cites·11 claims
- 2784US6712681B1Polishing pads with polymer filled fibrous web, and methods for fabricating and using sameIBM·Filed 2000·Granted Mar 30, 2004·26 cites·24 claims
- 2884US6340325B1Polishing pad grooving method and apparatusIBM·Filed 2000·Granted Jan 22, 2002·31 cites·19 claims
- 2983US8415248B2Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming sameCHEN SHYNG-TSONG·Filed 2012·Granted Apr 9, 2013·6 cites·16 claims
- 3083US6267659B1Stacked polish padIBM·Filed 2000·Granted Jul 31, 2001·27 cites·9 claims
- 3182US8519540B2Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming sameCHEN SHYNG-TSONG·Filed 2009·Granted Aug 27, 2013·10 cites·17 claims
- 3282US8084862B2Interconnect structures with patternable low-k dielectrics and method of fabricating sameLIN QINGHUANG·Filed 2007·Granted Dec 27, 2011·6 cites·6 claims
- 3381US7084479B2Line level air gapsIBM·Filed 2003·Granted Aug 1, 2006·27 cites·15 claims
- 3480US6964604B2Fiber embedded polishing padFREUDENBERG NONWOVENS LTD·Filed 2004·Granted Nov 15, 2005·19 cites·22 claims
- 3578US7439624B2Enhanced mechanical strength via contactsIBM·Filed 2006·Granted Oct 21, 2008·6 cites·3 claims
- 3677US7671470B2Enhanced mechanical strength via contactsIBM·Filed 2008·Granted Mar 2, 2010·5 cites·18 claims
- 3777US7402883B2Back end of the line structures with liner and noble metal layerIBM·Filed 2006·Granted Jul 22, 2008·6 cites·13 claims
- 3876US11189566B2Tight pitch via structures enabled by orthogonal and non-orthogonal merged viasIBM·Filed 2018·Granted Nov 30, 2021·2 cites·20 claims
- 3975US6734096B2Fine-pitch device lithography using a sacrificial hardmaskIBM·Filed 2002·Granted May 11, 2004·22 cites·17 claims
- 4074US10672984B2Resistive memory crossbar array compatible with Cu metallizationIBM·Filed 2019·Granted Jun 2, 2020·1 cites·20 claims
- 4174US6989117B2Polishing pads with polymer filled fibrous web, and methods for fabricating and using sameIBM·Filed 2004·Granted Jan 24, 2006·15 cites·4 claims
- 4272US8450854B2Interconnect structures with patternable low-k dielectrics and method of fabricating sameLIN QINGHUANG·Filed 2010·Granted May 28, 2013·2 cites·17 claims
- 4371US9105641B2Profile control in interconnect structuresIBM·Filed 2014·Granted Aug 11, 2015·2 cites·12 claims
- 4471US7253098B2Maintaining uniform CMP hard mask thicknessIBM·Filed 2004·Granted Aug 7, 2007·13 cites·7 claims
- 4568US8232195B2Method for fabricating back end of the line structures with liner and seed materialsYANG CHIH-CHAO·Filed 2008·Granted Jul 31, 2012·3 cites·12 claims
- 4667US11038104B2Resistive memory crossbar array with top electrode inner spacersIBM·Filed 2020·Granted Jun 15, 2021·0 cites·20 claims
- 4766US11735468B2Interconnect structures including self aligned viasIBM·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 4866US9508647B2Single damascene interconnect structureIBM·Filed 2015·Granted Nov 29, 2016·1 cites·14 claims
- 4966US7670943B2Enhanced mechanical strength via contactsIBM·Filed 2008·Granted Mar 2, 2010·2 cites·6 claims
- 5060US8716133B2Three photomask sidewall image transfer methodCHEN SHYNG-TSONG·Filed 2012·Granted May 6, 2014·1 cites·20 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →