Inventor · disambiguated record
Chih-Ming Chung
Also filed as: CHUNG CHIH-MING
30 granted patents·13 pending applications·420 citations·filing 1999–2024
97Inventor score
Files withADVANCED SEMICONDUCTOR ENG19APPLE INC12G TECH OPTOELECTRONICS CORP3CHUNG CHIH-MING2ACCTON TECHNOLOGY CORP1
Top patents by PatentIndex Score
43 records- 0197US9583472B2Fan out system in package and method for forming the sameAPPLE INC·Filed 2015·Granted Feb 28, 2017·28 cites·18 claims
- 0296US6921968B2Stacked flip chip packageADVANCE SEMICONDUCTOR ENGINEER·Filed 2004·Granted Jul 26, 2005·177 cites·7 claims
- 0391US8963311B2PoP structure with electrically insulating material between packagesAPPLE INC·Filed 2012·Granted Feb 24, 2015·11 cites·13 claims
- 0490US8546932B1Thin substrate PoP structureCHUNG CHIH-MING·Filed 2012·Granted Oct 1, 2013·16 cites·23 claims
- 0586US7327018B2Chip package structure, package substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Feb 5, 2008·14 cites·9 claims
- 0682US9452591B2Tempered glass screen protector applied to a portable electronic deviceG-TECH OPTOELECTRONICS CORP·Filed 2015·Granted Sep 27, 2016·4 cites·10 claims
- 0782US7834469B2Stacked type chip package structure including a chip package and a chip that are stacked on a lead frameADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 16, 2010·12 cites·18 claims
- 0881US9754924B2Fan-out pop stacking processAPPLE INC·Filed 2016·Granted Sep 5, 2017·3 cites·17 claims
- 0980US7163840B2Flip chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 16, 2007·25 cites·9 claims
- 1079US7262510B2Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 28, 2007·7 cites·6 claims
- 1178US7125745B2Multi-chip package substrate for flip-chip and wire bondingADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 24, 2006·26 cites·4 claims
- 1275US7482200B2Process for fabricating chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 27, 2009·5 cites·7 claims
- 1375US6201299B1Substrate structure of BGA semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Mar 13, 2001·47 cites·8 claims
- 1474US7902650B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Mar 8, 2011·7 cites·19 claims
- 1574US7375435B2Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 20, 2008·6 cites·13 claims
- 1672US7098071B2Method for flip chip bonding by utilizing an interposer with embedded bumpsADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 29, 2006·5 cites·16 claims
- 1768US11908819B2Semiconductor packaging substrate fine pitch metal bump and reinforcement structuresAPPLE INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 1868US11545455B2Semiconductor packaging substrate fine pitch metal bump and reinforcement structuresAPPLE INC·Filed 2019·Granted Jan 3, 2023·1 cites·22 claims
- 1968US9601464B2Thermally enhanced package-on-package structureAPPLE INC·Filed 2014·Granted Mar 21, 2017·2 cites·17 claims
- 2067US12464667B2Display cover glassG TECH OPTOELECTRONICS CORP·Filed 2022·Granted Nov 4, 2025·0 cites·8 claims
- 2166US8384204B2Circuit carrier and semiconductor package using the sameADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 26, 2013·1 cites·15 claims
- 2264US9379097B2Fan-out PoP stacking processAPPLE INC·Filed 2014·Granted Jun 28, 2016·1 cites·9 claims
- 2364US9263426B2PoP structure with electrically insulating material between packagesAPPLE INC·Filed 2015·Granted Feb 16, 2016·1 cites·13 claims
- 2464US8766424B2Thin substrate PoP structureAPPLE INC·Filed 2013·Granted Jul 1, 2014·1 cites·20 claims
- 2562US9067813B2Forming mold and related forming device and forming method using sameG TECH OPTOELECTRONICS CORP·Filed 2012·Granted Jun 30, 2015·1 cites·16 claims
- 2662US7565737B2Manufacturing method of package substrateADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jul 28, 2009·2 cites·9 claims
- 2760US6673656B2Semiconductor chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 6, 2004·9 cites·4 claims
- 2860US2024421126A1Chip Singulation Assisted Structures and Methods for Improving Bonding Interface QualityAPPLE INC·Filed 2024·Application pending·0 cites
- 2957US2014210111A1Embedded package on package systemsAPPLE INC·Filed 2013·Application pending·0 cites
- 3051US8889488B2Method for manufacturing semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 18, 2014·0 cites·20 claims
- 3148US2007085218A1Flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 3245US2009278243A1Stacked type chip package structure and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 3344US2009267210A1Integrated circuit package and manufacturing method thereofCHUANG YAO-KAI·Filed 2009·Application pending·0 cites
- 3444US2015255366A1Embedded system in packageAPPLE INC·Filed 2014·Application pending·0 cites
- 3541US2007052082A1Multi-chip package structureLEE CHENG-YIN·Filed 2006·Application pending·0 cites
- 3641US2006281223A1Packaging method and package using the sameACCTON TECHNOLOGY CORP·Filed 2005·Application pending·0 cites
- 3740US6150730AChip-scale semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Nov 21, 2000·8 cites·6 claims
- 3839US8546950B2Semiconductor package and manufacturing method thereofCHAO SHIN-HUA·Filed 2010·Granted Oct 1, 2013·0 cites·19 claims
- 3939US2005056933A1Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 4038US2004183180A1Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 4136US2002130250A1Method for detecting a waferFiled 2001·Application pending·0 cites
- 4235US2005275080A1Multi-chip module package structureCHUNG CHIH-MING·Filed 2004·Application pending·0 cites
- 4333US2002180057A1Chip stack-type semiconductor packageFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →