Inventor · disambiguated record
Shang-Wei Chen
Also filed as: CHEN SHANG W · CHEN SHANG-WEI
17 granted patents·17 pending applications·66 citations·filing 2003–2024
91Inventor score
Files withPHOENIX PREC TECHNOLOGY CORP12UNIMICRON TECHNOLOGY CORP5CORETRONIC CORP4RITDISPLAY CORP3CHEN SHANG-WEI2
Top patents by PatentIndex Score
34 records- 0185US7719104B2Circuit board structure with embedded semiconductor chip and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted May 18, 2010·14 cites·11 claims
- 0280US9329328B2Light guide plate and backlight module using the sameCHEN SHANG-WEI·Filed 2013·Granted May 3, 2016·9 cites·44 claims
- 0376US7598610B2Plate structure having chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Oct 6, 2009·7 cites·7 claims
- 0473US8035127B2Packaging substrate structure with a semiconductor chip embedded thereinUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Oct 11, 2011·6 cites·9 claims
- 0573US7863729B2Circuit board structure embedded with semiconductor chipsUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Jan 4, 2011·5 cites·10 claims
- 0669US7365272B2Circuit board with identifiable information and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Apr 29, 2008·13 cites·7 claims
- 0768US8354338B2Carrier board structure with embedded semiconductor chip and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jan 15, 2013·4 cites·7 claims
- 0867US10952325B2Printed circuit board stack structure and method of forming the sameUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Mar 16, 2021·1 cites·20 claims
- 0961US12422912B2Electronic system and protection method for power management circuitMEDIATEK INC·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1059US8070932B2Circuit board with identifiable information and method for fabricating the sameHSU SHIH-PING·Filed 2008·Granted Dec 6, 2011·1 cites·15 claims
- 1157US2024210805A1Illumination system and projection apparatusCORETRONIC CORP·Filed 2023·Application pending·0 cites
- 1253US6858874B2Package structure of organic electroluminescence panelRITDISPLAY CORP·Filed 2003·Granted Feb 22, 2005·6 cites·29 claims
- 1353US2024103350A1Light source assembly and projection deviceCORETRONIC CORP·Filed 2023·Application pending·0 cites
- 1451US12279078B2Projection apparatusCORETRONIC CORP·Filed 2023·Granted Apr 15, 2025·0 cites·18 claims
- 1550US2008145975A1Method for fabricating circuit board structure with embedded semiconductor chipPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1650US2008142951A1Circuit board structure with embedded semiconductor chipPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1749US2024319782A1Processor for managing power, power management system and method thereofMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1847US2007181995A1Circuit board structure embedded with semiconductor chipsHSU SHIH PING·Filed 2006·Application pending·0 cites
- 1946US11586103B2Illumination system and projection apparatusCORETRONIC CORP·Filed 2021·Granted Feb 21, 2023·0 cites·18 claims
- 2046US2009102039A1Package on package structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2146US2009085192A1Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2245US2008251915A1Structure of semiconductor chip and package structure having semiconductor chip embedded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2344US2009032930A1Packaging substrate having chip embedded therein and manufacturing method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2443US2007241444A1Carrier board structure with chip embedded therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2543US2008029872A1Plate structure having chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2643US2008185704A1Carrier plate structure havign a chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2741US2007087547A1Wafer structure with electroless plating metal connecting layer and method for fabricating the sameCHEN SHANG W·Filed 2006·Application pending·0 cites
- 2840US2006125606A1Method for reading an IC tag concealing part of dataIND TECH RES INST·Filed 2005·Application pending·0 cites
- 2938US9776360B2Transfer printing apparatus and manufacturing method of light guiding filmYANG CHING-TANG·Filed 2014·Granted Oct 3, 2017·0 cites·14 claims
- 3037US7208870B2Silver alloy used in an organic electroluminescent panelRITDISPLAY CORP·Filed 2003·Granted Apr 24, 2007·0 cites·19 claims
- 3137US2007085205A1Semiconductor device with electroless plating metal connecting layer and method for fabricating the sameCHEN SHANG-WEI·Filed 2006·Application pending·0 cites
- 3236US6846687B2Process of packaging organic electroluminescent panelRITDISPLAY CORP·Filed 2003·Granted Jan 25, 2005·0 cites·15 claims
- 3332US2006114102A1High performance RFID system and operating method thereofIND TECH RES INST·Filed 2005·Application pending·0 cites
- 3429USD969745SElectronic connectorUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Nov 15, 2022·0 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →