Inventor · disambiguated record
Eric W. Buddrius
Also filed as: BUDDRIUS ERIC · BUDDRIUS ERIC W
14 granted patents·9 pending applications·70 citations·filing 2012–2025
88Inventor score
Top patents by PatentIndex Score
23 records- 0194US9257364B2Integrated heat spreader that maximizes heat transfer from a multi-chip packageAHUJA SANDEEP·Filed 2012·Granted Feb 9, 2016·34 cites·19 claims
- 0293US9646910B2Integrated heat spreader that maximizes heat transfer from a multi-chip packageINTEL CORP·Filed 2016·Granted May 9, 2017·13 cites·21 claims
- 0391US10455685B1Electronic device, socket, and spacer to alter socket profileINTEL CORP·Filed 2018·Granted Oct 22, 2019·12 cites·20 claims
- 0488US11449111B2Scalable, high load, low stiffness, and small footprint loading mechanismINTEL CORP·Filed 2018·Granted Sep 20, 2022·6 cites·15 claims
- 0579US9825387B2Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusionINTEL CORP·Filed 2016·Granted Nov 21, 2017·3 cites·17 claims
- 0673US11291115B2Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array socketsINTEL CORP·Filed 2018·Granted Mar 29, 2022·2 cites·16 claims
- 0766US2025234478A1Patterned bolster plate and composite back plate for semiconductor chip lga package and cooling assembly retentionINTEL CORP·Filed 2025·Application pending·0 cites
- 0863US12279395B2Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retentionINTEL CORP·Filed 2021·Granted Apr 15, 2025·0 cites·14 claims
- 0962US12176643B2Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigationINTEL CORP·Filed 2020·Granted Dec 24, 2024·0 cites·21 claims
- 1060US2025024622A1Protrusions of socket bodies having metalINTEL CORP·Filed 2024·Application pending·0 cites
- 1158US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 1257US2025112392A1Semiconductor package carrier, and a corresponding system and method of useINTEL CORP·Filed 2024·Application pending·0 cites
- 1357US2025223994A1Reinforced polymer nuts for socket loadingBUDDRIUS ERIC W·Filed 2025·Application pending·0 cites
- 1456US2024407092A1Covers for integrated circuit package socketsINTEL CORP·Filed 2024·Application pending·0 cites
- 1554US12315780B2Technologies for processor loading mechanismsINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·10 claims
- 1653US2023395460A1Backside integrated torsion loading mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 1752US2023019643A1Integrated separator devices for hardware component separationINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US11818832B2Socket load regulation utilizing CPU carriers with shim componentsINTEL CORP·Filed 2020·Granted Nov 14, 2023·0 cites·7 claims
- 1950US11557529B2Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutionsINTEL CORP·Filed 2018·Granted Jan 17, 2023·0 cites·17 claims
- 2048US2023027076A1Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2146US11387163B2Scalable debris-free socket loading mechanismINTEL CORP·Filed 2018·Granted Jul 12, 2022·0 cites·16 claims
- 2246US2024421025A1Enhanced i/o semiconductor chip package and cooling assembly having side i/osINTEL CORP·Filed 2021·Application pending·0 cites
- 2343US10680367B2Cable retention assemblies including torsional elementsINTEL CORP·Filed 2016·Granted Jun 9, 2020·0 cites·6 claims
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