Inventor · disambiguated record
Joe Siegel
Also filed as: SIEGEL JOE
5 granted patents·2 pending applications·20 citations·filing 2010–2022
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0190US9437561B2Semiconductor chip with redundant thru-silicon-viasBLACK BRYAN·Filed 2010·Granted Sep 6, 2016·12 cites·17 claims
- 0282US8704353B2Thermal management of stacked semiconductor chips with electrically non-functional interconnectsSU MICHAEL·Filed 2012·Granted Apr 22, 2014·7 cites·24 claims
- 0375US12094853B2Semiconductor chip with redundant thru-silicon-viasADVANCED MICRO DEVICES INC·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 0468US11469212B2Semiconductor chip with redundant thru-silicon-viasADVANCED MICRO DEVICES INC·Filed 2016·Granted Oct 11, 2022·1 cites·20 claims
- 0538US10290606B2Interposer with identification systemALFANO MICHAEL·Filed 2012·Granted May 14, 2019·0 cites·19 claims
- 0638US2013256913A1Die stacking with coupled electrical interconnects to align proximity interconnectsBLACK BRYAN·Filed 2012·Application pending·0 cites
- 0738US2013256895A1Stacked semiconductor components with universal interconnect footprintSU MICHAEL·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →