Inventor · disambiguated record
Hsing-Tsai Huang
Also filed as: HUANG HSING-TSAI
7 granted patents·2 pending applications·8 citations·filing 2002–2021
75Inventor score
Top patents by PatentIndex Score
9 records- 0175US9443825B2Multi-function miniaturized surface-mount device and process for producing the sameSFI ELECTRONICS TECH INC·Filed 2016·Granted Sep 13, 2016·4 cites·7 claims
- 0260US9691736B2Miniaturized SMD diode package and process for producing the sameSFI ELECTRONICS TECH INC·Filed 2015·Granted Jun 27, 2017·1 cites·2 claims
- 0359US11404209B2Electrical device package structure and manufacturing method thereofSFI ELECTRONICS TECH INC·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
- 0449US9691735B2Miniaturized SMD diode package and process for producing the sameSFI ELECTRONICS TECH INC·Filed 2014·Granted Jun 27, 2017·0 cites·6 claims
- 0544US2022418095A1Esd suppressor and manufacturing method thereofSFI ELECTRONICS TECH INC·Filed 2021·Application pending·0 cites
- 0643US6815519B2Acidic fluorine-containing poly (siloxane amideimide) silica hybridsCHUNG SHAN INST OF SCIENCE·Filed 2002·Granted Nov 9, 2004·1 cites·8 claims
- 0741US9165872B2Chip scale diode package no containing outer lead pins and process for producing the sameSFI ELECTRONICS TECHNOLOGY INC·Filed 2014·Granted Oct 20, 2015·0 cites·6 claims
- 0835US6779458B1Method and apparatus for installing aft insulation in rocket motor caseCHUNG SHAN INST OF SCIENCE·Filed 2003·Granted Aug 24, 2004·2 cites·5 claims
- 0935US2020411470A1Package method for attached single small size and array type of chip semiconductor componentSFI ELECTRONICS TECH INC·Filed 2019·Application pending·0 cites
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