Inventor · disambiguated record
Tsyr-Shyang Liou
Also filed as: LIOU TSYR-SHYANG
14 granted patents·113 citations·filing 1999–2022
90Inventor score
Files withRICHWAVE TECHNOLOGY CORP8TAIWAN SEMICONDUCTOR MFG3IND TECH RES INST1LIOU TSYR-SHYANG1PENG KUO-JUI1
Top patents by PatentIndex Score
14 records- 0193US7193475B2Single-ended input to differential output low noise amplifier with a cascode topologyRICHWAVE TECHNOLOGY CORP·Filed 2005·Granted Mar 20, 2007·35 cites·16 claims
- 0290US7205844B2Low noise and high gain low noise amplifierRICHWAVE TECHNOLOGY CORP·Filed 2005·Granted Apr 17, 2007·23 cites·5 claims
- 0370US6180478B1Fabrication process for a single polysilicon layer, bipolar junction transistor featuring reduced junction capacitanceIND TECH RES INST·Filed 1999·Granted Jan 30, 2001·32 cites·21 claims
- 0469US11646712B2Bulk acoustic wave structure and bulk acoustic wave deviceRICHWAVE TECHNOLOGY CORP·Filed 2022·Granted May 9, 2023·0 cites·14 claims
- 0567US7375590B2Single-ended input to differential-ended output low noise amplifier implemented with cascode and cascade topologyRICHWAVE TECHNOLOGY CORP·Filed 2006·Granted May 20, 2008·7 cites·16 claims
- 0667US7372102B2Structure having a shallow trench-deep trench isolation region for a BiCMOS/CMOS technologyTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 13, 2008·3 cites·12 claims
- 0763US7015086B2Method of forming a shallow trench-deep trench isolation region for a BiCMOS/CMOS technologyTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 21, 2006·10 cites·14 claims
- 0859US7460851B2Method and apparatus for integrating a surface acoustic wave filter and a transceiverRICHWAVE TECHNOLOGY CORP·Filed 2005·Granted Dec 2, 2008·2 cites·20 claims
- 0957US11362637B2Bulk acoustic wave structure, bulk acoustic wave device, and manufacturing method thereofRICHWAVE TECHNOLOGY CORP·Filed 2018·Granted Jun 14, 2022·0 cites·10 claims
- 1051USRE46540EMethod and apparatus for integrating a surface acoustic wave filter and a transceiverRICHWAVE TECHNOLOGY CORP·Filed 2014·Granted Sep 5, 2017·0 cites·20 claims
- 1147US7250344B2Method of forming a shallow trench-deep trench isolation region for a BiCMOS/CMOS technologyTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jul 31, 2007·0 cites·14 claims
- 1246US8580627B2Compound semiconductor device and method for fabricating the samePENG KUO-JUI·Filed 2010·Granted Nov 12, 2013·1 cites·6 claims
- 1344US10923365B2Connection structure and method for forming the sameRICHWAVE TECHNOLOGY CORP·Filed 2019·Granted Feb 16, 2021·0 cites·17 claims
- 1429US8129805B2Microelectromechanical system (MEMS) device and methods for fabricating the sameLIOU TSYR-SHYANG·Filed 2010·Granted Mar 6, 2012·0 cites·18 claims
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