Inventor · disambiguated record
Leif Bergstedt
Also filed as: BERGSTEDT LEIF · BERGSTEDT LEIF R · BERGSTEDT LEIF ROLAND
30 granted patents·8 pending applications·637 citations·filing 1997–2013
97Inventor score
Top patents by PatentIndex Score
38 records- 0195US6690583B1Carrier for electronic componentsERICSSON TELEFON AB L M·Filed 2000·Granted Feb 10, 2004·120 cites·10 claims
- 0295US6266016B1Microstrip arrangementERICSSON TELEFON AB L M·Filed 2000·Granted Jul 24, 2001·226 cites·9 claims
- 0381US5977915AMicrostrip structureERICSSON TELEFON AB L M·Filed 1998·Granted Nov 2, 1999·32 cites·29 claims
- 0476US6421225B2Electric componentERICSSON TELEFON AB L M·Filed 1999·Granted Jul 16, 2002·38 cites·17 claims
- 0574US6459585B1Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the methodERICSSON TELEFON AB L M·Filed 2000·Granted Oct 1, 2002·17 cites·12 claims
- 0666US6724283B2Arrangement mounted on a printed circuit board and method of producing such an arrangementERICSSON TELEFON AB L M·Filed 2001·Granted Apr 20, 2004·11 cites·14 claims
- 0766US6395378B2PCB and method for making PCB with thin copper layerERICSSON TELEFON AB L M·Filed 2001·Granted May 28, 2002·11 cites·6 claims
- 0866US6108205AMeans and method for mounting electronicsERICSSON TELEFON AB L M·Filed 1997·Granted Aug 22, 2000·33 cites·12 claims
- 0964US6424318B1Method and arrangement pertaining to microwave lensesERICSSON TELEFON AB L M·Filed 2000·Granted Jul 23, 2002·15 cites·25 claims
- 1064US6174562B1Method and device on printed boardsERICSSON TELEFON AB L M·Filed 1997·Granted Jan 16, 2001·24 cites·15 claims
- 1160US7102480B2Printed circuit board integrated switchERICSSON TELEFON AB L M·Filed 2001·Granted Sep 5, 2006·8 cites·13 claims
- 1260US6249962B1Process for manufacturing a multi-layer circuit board with supporting layers of different materialsERICSSON TELEFON AB L M·Filed 1998·Granted Jun 26, 2001·18 cites·9 claims
- 1356US6617509B1Arrangement relating to conductor carriers and methods for the manufacture of such carriersERICSSON TELEFON AB L M·Filed 2000·Granted Sep 9, 2003·6 cites·5 claims
- 1452US7192882B2Component for electromagnetic waves and a method for manufacturing the sameERICSSON TELEFON AB L M·Filed 2002·Granted Mar 20, 2007·4 cites·6 claims
- 1552US2003152694A1Optical element and method for manufacturing the sameFiled 2003·Application pending·0 cites
- 1651US6552265B1Printed board assembly and method of its manufactureERICSSON TELEFON AB L M·Filed 1999·Granted Apr 22, 2003·12 cites·19 claims
- 1749US7051430B2Method of manufacturing a printed board assemblyERICSSON TELEFON AB L M·Filed 2003·Granted May 30, 2006·3 cites·19 claims
- 1848US6433423B2Method and an arrangement relating to chip carriersERICSSON TELEFON AB L M·Filed 2000·Granted Aug 13, 2002·5 cites·26 claims
- 1945US6011692AChip supporting elementERICSSON TELEFON AB L M·Filed 1998·Granted Jan 4, 2000·16 cites·3 claims
- 2041US9301426B2Microwave moduleHUAWEI TECH CO LTD·Filed 2013·Granted Mar 29, 2016·0 cites·21 claims
- 2141US9252474B2Coupling arrangementHUAWEI TECH CO LTD·Filed 2013·Granted Feb 2, 2016·0 cites·18 claims
- 2241US6717063B2Multi-layer circuit board with supporting layers of different materialsERICSSON TELEFON AB L M·Filed 2001·Granted Apr 6, 2004·0 cites·10 claims
- 2341US6038122ADecoupling capacitorERICSSON TELEFON AB L M·Filed 1998·Granted Mar 14, 2000·13 cites·5 claims
- 2438US9172126B2Module and coupling arrangementHUAWEI TECH CO LTD·Filed 2013·Granted Oct 27, 2015·0 cites·17 claims
- 2538US2001050603A1Microwave dielectric materialFiled 2001·Application pending·0 cites
- 2638US2002023775A1Sequentially processed circuitryFiled 2001·Application pending·0 cites
- 2737US6230401B1Method and an arrangement in an electronics systemERICSSON TELEFON AB L M·Filed 1998·Granted May 15, 2001·6 cites·10 claims
- 2836US8822276B2Magnetic integration double-ended converterBERGSTEDT LEIF·Filed 2012·Granted Sep 2, 2014·0 cites·5 claims
- 2936US6150982AAntenna arrangementERICSSON TELEFON AB L M·Filed 1998·Granted Nov 21, 2000·10 cites·10 claims
- 3036US2002058137A1Dielectric spacing layerFiled 2001·Application pending·0 cites
- 3135US2002140611A1Antenna arrangementERICSSON TELEFON AB L M·Filed 2002·Application pending·0 cites
- 3235US2002080089A1Antenna arrangement and a communication arrangement comprising the sameFiled 2001·Application pending·0 cites
- 3334US6951797B1Method relating to anodic bondingIMEGO AB·Filed 2000·Granted Oct 4, 2005·0 cites·19 claims
- 3434US2012224346A1Arrangement with chip and carrierBERGSTEDT LEIF·Filed 2012·Application pending·0 cites
- 3531US6369677B1Arrangement for more even current distribution in a transmission lineERICSSON TELEFON AB L M·Filed 1999·Granted Apr 9, 2002·1 cites·12 claims
- 3630US6370030B1Device and method in electronics systemsERICSSON TELEFON AB L M·Filed 1998·Granted Apr 9, 2002·6 cites·8 claims
- 3729US2012211487A1Microwave unit and method thereforeBERGSTEDT LEIF·Filed 2012·Application pending·0 cites
- 3828US6459347B1Method for vertical connection of conductors in a device in the microwave rangeERICSSON TELEFON AB L M·Filed 1999·Granted Oct 1, 2002·2 cites·6 claims
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