Inventor · disambiguated record
Zhiqi Wang
Also filed as: WANG ZHIQI
34 granted patents·25 pending applications·62 citations·filing 2008–2022
95Inventor score
Files withCHINA WAFER LEVEL CSP CO LTD44CHINA WAFER LEVEL CSP LTD3BESTECHNIC SHANGHAI CO LTD2WANG ZHIQI2APPLE INC1
Top patents by PatentIndex Score
59 records- 0194US11323143B1Device and method for wireless transmissionBESTECHNIC SHANGHAI CO LTD·Filed 2021·Granted May 3, 2022·3 cites·20 claims
- 0291US7781250B2Wafer level chip size package for MEMS devices and method for fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2008·Granted Aug 24, 2010·27 cites·10 claims
- 0384US10133907B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Nov 20, 2018·5 cites·20 claims
- 0476US10276540B2Chip packaging method and chip packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Apr 30, 2019·3 cites·17 claims
- 0572US10090217B2Chip packaging method and package structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 2, 2018·2 cites·16 claims
- 0670US10541186B2Chip package and chip packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jan 21, 2020·2 cites·13 claims
- 0769US9748162B2Chip to wafer package with top electrodes and method of formingCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Aug 29, 2017·2 cites·15 claims
- 0869US8421533B2Adaptive digital predistortion device and methodSUN GANG·Filed 2011·Granted Apr 16, 2013·3 cites·9 claims
- 0968US11581909B2Device and method for wireless transmissionBESTECHNIC SHANGHAI CO LTD·Filed 2022·Granted Feb 14, 2023·0 cites·20 claims
- 1068US10763293B2Image sensing chip package and image sensing chip packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·18 claims
- 1166US8472556B2Amplifier device and predistortion control methodSHI ZHAN·Filed 2010·Granted Jun 25, 2013·4 cites·10 claims
- 1263US10126151B2Wafer-level chip package structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Nov 13, 2018·1 cites·23 claims
- 1362USD1006331SHair dryer holderSHENZHEN SOGUDE TECH CO LTD·Filed 2022·Granted Nov 28, 2023·3 cites·1 claims
- 1461US10325946B2Packaging method and package structure for image sensing chipCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Jun 18, 2019·1 cites·15 claims
- 1561US10108837B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 23, 2018·1 cites·19 claims
- 1661US9601531B2Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regionsCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Mar 21, 2017·1 cites·8 claims
- 1758US11049899B2Encapsulation structure of image sensing chip, and encapsulation method thereforCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jun 29, 2021·1 cites·20 claims
- 1855US8174090B2Packaging structureWANG ZHIQI·Filed 2009·Granted May 8, 2012·2 cites·8 claims
- 1949US2023078536A1Conductive features on system-in-package surfacesAPPLE INC·Filed 2022·Application pending·0 cites
- 2047US11137346B2Wavelength-modulable spectrum generator, and system and method for measuring concentration of gas component based thereonUNIV CHONGQING SCI & TECH·Filed 2020·Granted Oct 5, 2021·0 cites·12 claims
- 2147US10817700B2Optical fingerprint recognition chip package and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Oct 27, 2020·0 cites·20 claims
- 2247US10685917B2Semiconductor device and manufacture method of the sameCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·13 claims
- 2347US10680033B2Chip packaging method and chip packageCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·25 claims
- 2447US10541264B2Package-on-package structure and package-on-package methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·20 claims
- 2547US9231018B2Wafer level packaging structure for image sensors and wafer level packaging method for image sensorsCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Jan 5, 2016·0 cites·18 claims
- 2645US9299735B2Image sensor package structure and methodCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Mar 29, 2016·0 cites·38 claims
- 2745US7755155B2Packaging structure and method for fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2008·Granted Jul 13, 2010·0 cites·11 claims
- 2844US2022415320A1Systems and Methods for Implementing Smart Assistant SystemsMETA PLATFORMS INC·Filed 2022·Application pending·0 cites
- 2942US2010171134A1Optical converter and manufacturing method thereof and light emitting diodeCHINA WAFER LEVEL CSP LTD·Filed 2009·Application pending·0 cites
- 3041US2020051938A9Fingerprint chip packaging method and fingerprint chip packageCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 3140US10659297B2Negotiation mode processing method and intelligent network deviceHUAWEI TECH CO LTD·Filed 2018·Granted May 19, 2020·0 cites·19 claims
- 3240US2019010046A1Packaging structure and packaging method of mems chip and asic chipCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 3339US2019202685A1Chip package and chip packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 3438US10283483B2Packaging method and package structure for image sensing chipCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted May 7, 2019·0 cites·15 claims
- 3538US2010065956A1Packaging structure, packaging method and photosensitive deviceWANG ZHIQI·Filed 2009·Application pending·0 cites
- 3638US2018090524A1Image sensor package and method of packaging the sameCHINA WATER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
- 3737US2020243588A1Packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
- 3836US10529758B2Packaging method and packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Jan 7, 2020·0 cites·9 claims
- 3936US10497728B2Fingerprint sensing chip packaging method and fingerprint sensing chip packageCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Granted Dec 3, 2019·0 cites·18 claims
- 4036US2019074258A1Solder pad, semiconductor chip comprising solder pad, and forming method thereforCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 4136US2019165013A1Package for iris recognition imaging module and manufacturing method thereofCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 4234US10541262B2Image sensing chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Jan 21, 2020·0 cites·12 claims
- 4334US10096643B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 9, 2018·0 cites·15 claims
- 4434US2018294302A1Image sensing chip packaging structure and methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 4534US2018308890A1Image sensing chip packaging structure and packaging method thereforCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 4633US2019067352A1Photosensitive chip packaging structure and packaging method thereofCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 4733US2019013302A1Packaging method and package structure for fingerprint recognition chip and drive chipCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 4833US2018129848A1Chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 4933US2018108585A1Chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 5033US2018114048A1Chip packaging method and chip packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →