Inventor · disambiguated record
Gershon Akerling
Also filed as: AKERLING GERSHON
18 granted patents·1 pending application·414 citations·filing 1997–2018
94Inventor score
Top patents by PatentIndex Score
19 records- 0192US6936913B2High performance vias for vertical IC packagingNORTHROP GRUMMAN CORP·Filed 2002·Granted Aug 30, 2005·80 cites·16 claims
- 0291US6055722AStripline flexible cable to printed circuit board attachment systemTRW INC·Filed 1998·Granted May 2, 2000·95 cites·7 claims
- 0389US6216941B1Method for forming high frequency connections to high temperature superconductor circuits and other fragile materialsTRW INC·Filed 2000·Granted Apr 17, 2001·52 cites·12 claims
- 0480US5924875ACryogenic flex cable connectorTRW INC·Filed 1997·Granted Jul 20, 1999·40 cites·3 claims
- 0578US6219254B1Chip-to-board connection assembly and method thereforTRW INC·Filed 1999·Granted Apr 17, 2001·65 cites·53 claims
- 0662US6768189B1High power chip scale packageNORTHROP GRUMMAN CORP·Filed 2003·Granted Jul 27, 2004·9 cites·23 claims
- 0760US5920464AReworkable microelectronic multi-chip moduleTRW INC·Filed 1997·Granted Jul 6, 1999·20 cites·20 claims
- 0856US11056760B2Method of making a low mass foam electrical structureNORTHROP GRUMMAN SYSTEMS CORP·Filed 2018·Granted Jul 6, 2021·0 cites·5 claims
- 0954US5970608ACryogenic flex cable connectorTRW INC·Filed 1998·Granted Oct 26, 1999·13 cites·5 claims
- 1053US9293800B2RF transmission line disposed within a conductively plated cavity located in a low mass foam housingMASS STEVEN J·Filed 2011·Granted Mar 22, 2016·1 cites·10 claims
- 1151US6146912AMethod for parallel alignment of a chip to substrateTRW INC·Filed 1999·Granted Nov 14, 2000·16 cites·3 claims
- 1250US10122063B2Method of making a low mass foam electrical structureNORTHROP GRUMMAN SYSTEMS CORP·Filed 2016·Granted Nov 6, 2018·0 cites·3 claims
- 1350US9960204B2Waveguide and semiconductor packagingNORTHROP GRUMMAN SYSTEMS CORP·Filed 2016·Granted May 1, 2018·0 cites·20 claims
- 1450US9478458B2Waveguide and semiconductor packagingNORTHROP GRUMMAN SYSTEMS CORP·Filed 2014·Granted Oct 25, 2016·0 cites·12 claims
- 1547US6050476AReworkable microelectronic multi-chip moduleTRW INC·Filed 1998·Granted Apr 18, 2000·11 cites·2 claims
- 1642US6055723AProcess of fabricating high frequency connections to high temperature superconductor circuitsTRW INC·Filed 1998·Granted May 2, 2000·9 cites·6 claims
- 1740US7135779B2Method for packaging integrated circuit chipsNORTHROP GRUMMAN CORP·Filed 2004·Granted Nov 14, 2006·0 cites·23 claims
- 1840US2004214377A1Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packagingFiled 2003·Application pending·0 cites
- 1933US6032852AReworkable microelectronic multi-chip moduleTRW INC·Filed 1998·Granted Mar 7, 2000·3 cites·3 claims
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