Inventor · disambiguated record
Ulrich Mantz
Also filed as: MANTZ ULRICH
20 granted patents·2 pending applications·238 citations·filing 1998–2020
94Inventor score
Top patents by PatentIndex Score
22 records- 0196US8110814B2Ion sources, systems and methodsWARD BILLY W·Filed 2009·Granted Feb 7, 2012·33 cites·20 claims
- 0294US7485873B2Ion sources, systems and methodsALIS CORP·Filed 2006·Granted Feb 3, 2009·36 cites·25 claims
- 0390US7518122B2Ion sources, systems and methodsALIS CORP·Filed 2006·Granted Apr 14, 2009·19 cites·10 claims
- 0489US9236225B2Ion sources, systems and methodsCARL ZEISS MICROSCOPY LLC·Filed 2015·Granted Jan 12, 2016·4 cites·23 claims
- 0588US7427774B1Targets for measurements in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 23, 2008·17 cites·19 claims
- 0686US6031614AMeasurement system and method for measuring critical dimensions using ellipsometrySIEMENS AG·Filed 1998·Granted Feb 29, 2000·85 cites·49 claims
- 0776US8748845B2Ion sources, systems and methodsWARD BILLY W·Filed 2012·Granted Jun 10, 2014·2 cites·28 claims
- 0873US7405089B2Method and apparatus for measuring a surface profile of a sampleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 29, 2008·5 cites·21 claims
- 0973US7307735B2Method for determining the depth of a buried structureINFINEON TECHNOLOGIES AG·Filed 2004·Granted Dec 11, 2007·16 cites·15 claims
- 1071US9012867B2Ion sources, systems and methodsCARL ZEISS MICROSCOPY LLC·Filed 2014·Granted Apr 21, 2015·1 cites·20 claims
- 1166US8164071B2Electron beam source and method of manufacturing the sameDREXEL VOLKER·Filed 2009·Granted Apr 24, 2012·2 cites·27 claims
- 1262US7358491B2Method and apparatus for the depth-resolved characterization of a layer of a carrierINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 15, 2008·3 cites·11 claims
- 1358US6486675B1In-situ method for measuring the endpoint of a resist recess etch processINFINEON TECHNOLOGIES AG·Filed 2000·Granted Nov 26, 2002·8 cites·1 claims
- 1456US11378532B2Inspection system and inspection method to qualify semiconductor structuresZEISS CARL SMT GMBH·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 1556US7362453B2Method for the characterization of a filmINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 22, 2008·1 cites·19 claims
- 1653US7046363B2Optical measurement system and methodINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 16, 2006·6 cites·11 claims
- 1749US8723138B2Electron beam source and method of manufacturing the sameDREXEL VOLKER·Filed 2012·Granted May 13, 2014·0 cites·41 claims
- 1846US8384029B2Cross-section systems and methodsZEISS CARL NTS LLC·Filed 2009·Granted Feb 26, 2013·0 cites·14 claims
- 1946US2005118735A1Method for determining or inspecting a property of a patterned layerFiled 2004·Application pending·0 cites
- 2045US7262837B2Noninvasive method for characterizing and identifying embedded micropatternsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 28, 2007·0 cites·7 claims
- 2137US10509330B2Method and device for characterizing a wafer patterned using at least one lithography stepZEISS CARL SMT GMBH·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2237US2005239223A1Method and device for monitoring the etching operation for a regular depth structure in a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
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