Inventor · disambiguated record
Nobuaki Nakashima
Also filed as: NAKASHIMA NOBUAKI
16 granted patents·2 pending applications·70 citations·filing 1987–2019
91Inventor score
Top patents by PatentIndex Score
18 records- 0180US8747633B2Tantalum sputtering target and method for manufacturing the same, and method for manufacturing semiconductor elementNAKASHIMA NOBUAKI·Filed 2012·Granted Jun 10, 2014·5 cites·5 claims
- 0276US11220740B2Method of manufacturing sputtering target and sputtering targetTOSHIBA KK·Filed 2019·Granted Jan 11, 2022·0 cites·8 claims
- 0372USRE47788ESputtering target, manufacturing method thereof, and manufacturing method of semiconductor elementTOSHIBA KK·Filed 2018·Granted Dec 31, 2019·0 cites·30 claims
- 0469US7927167B2Getter material and evaporable getter device using the same, and electron tubeTOSHIBA KK·Filed 2010·Granted Apr 19, 2011·1 cites·15 claims
- 0564US4844736AMethod for the preparation of finely divided metal particlesIDEMITSU KOSAN CO·Filed 1987·Granted Jul 4, 1989·15 cites·15 claims
- 0663US9382613B2Sputtering target, manufacturing method thereof, and manufacturing method of semiconductor elementNAKASHIMA NOBUAKI·Filed 2012·Granted Jul 5, 2016·0 cites·4 claims
- 0761US11198933B2Method of manufacturing sputtering target and sputtering targetTOSHIBA KK·Filed 2019·Granted Dec 14, 2021·0 cites·6 claims
- 0860US10533248B2Method of manufacturing sputtering target and sputtering targetTOSHIBA KK·Filed 2016·Granted Jan 14, 2020·0 cites·8 claims
- 0957US5098652APrecision parts of non-magnetic stainless steelsTOSHIBA KK·Filed 1990·Granted Mar 24, 1992·13 cites·9 claims
- 1052US10473597B2Neutron grid, neutron grid stack, neutron grid device, and method of manufacturing neutron gridTOSHIBA KK·Filed 2018·Granted Nov 12, 2019·0 cites·12 claims
- 1146US2008012486A1Getter Material And Evaporable Getter Device Using The Same, And Electron TubeTOSHIBA KK·Filed 2005·Application pending·0 cites
- 1245US5315152ALead frame with improved adhesiveness property against plastic and plastic sealing type semiconductor packaging using said lead frameTOSHIBA KK·Filed 1991·Granted May 24, 1994·15 cites·16 claims
- 1345US2018196146A1Scintillator arrayTOSHIBA KK·Filed 2018·Application pending·0 cites
- 1441US5264050AFe-Ni based alloyTOSHIBA KK·Filed 1991·Granted Nov 23, 1993·12 cites·6 claims
- 1537US5210441ALead frame formed of a copper-zirconium alloyTOSHIBA KK·Filed 1991·Granted May 11, 1993·7 cites·14 claims
- 1635US11957052B2Thermoelectric material, manufacturing method of thermoelectric material, thermoelectric conversion element, and thermoelectric conversion moduleTOSHIBA KK·Filed 2019·Granted Apr 9, 2024·0 cites·18 claims
- 1729US5341025AIC package and LSI package using a lead frame formed of a copper-zirconium alloyTOSHIBA KK·Filed 1993·Granted Aug 23, 1994·1 cites·2 claims
- 1824US5729344AMethod and apparatus for forming an optical surface by optical etchingNIPPON ASPHERICAL LENS CO LTD·Filed 1996·Granted Mar 17, 1998·1 cites·8 claims
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