Inventor · disambiguated record
Junso Pak
Also filed as: PAK JUNSO
4 granted patents·2 pending applications·0 citations·filing 2021–2024
52Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0159US2025132271A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0258US2025157867A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0356US11908758B2Semiconductor package including dual stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·18 claims
- 0453US11908810B2Hybrid semiconductor device and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 0549US12213256B2Semiconductor package for improving power integrity characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 0641US12224260B2Semiconductor package including a dualized signal wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →