Inventor
KWON HEUNGKYU
KR21 patents
⚠️ This page may combine multiple inventors who share the name “KWON HEUNGKYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS11075138B2Jul 27, 2021
Semiconductor package system
SAMSUNG ELECTRONICS CO LTD7 citations83
US10198049B2Feb 5, 2019
Surface temperature management method of mobile device and memory thermal management method of multichip package
SAMSUNG ELECTRONICS CO LTD9 citations83
US9698088B2Jul 4, 2017
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD11 citations82
US8981543B2Mar 17, 2015
Semiconductor package and method of forming the same
SAMSUNG ELECTRONICS CO LTD7 citations80
US8952517B2Feb 10, 2015
Package-on-package device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD7 citations76
US11069623B2Jul 20, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10068881B2Sep 4, 2018
Package-on-package type semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9859237B2Jan 2, 2018
Chip using triple pad configuration and packaging method thereof
SAMSUNG ELECTRONICS CO LTD3 citations68
US12167312B2Dec 10, 2024
Electronic device and operating method
SAMSUNG ELECTRONICS CO LTD2 citations65
US12406899B2Sep 2, 2025
Semiconductor package system
SAMSUNG ELECTRONICS CO LTD0 citations62
US11658090B2May 23, 2023
Semiconductor package system
SAMSUNG ELECTRONICS CO LTD0 citations62
US11600607B2Mar 7, 2023
Semiconductor module including multiple power management semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US10991638B2Apr 27, 2021
Semiconductor package system
SAMSUNG ELECTRONICS CO LTD1 citations62
US11908758B2Feb 20, 2024
Semiconductor package including dual stiffener
SAMSUNG ELECTRONICS CO LTD0 citations59
US11244885B2Feb 8, 2022
Semiconductor package system
SAMSUNG ELECTRONICS CO LTD0 citations51
US11908810B2Feb 20, 2024
Hybrid semiconductor device and electronic device
SAMSUNG ELECTRONICS CO LTD0 citations48
KWON HEUNGKYU
3 patentsUS9606591B2Mar 28, 2017
Surface temperature management method of mobile device and memory thermal management method of multichip package
KWON HEUNGKYU16 citations82
US9214441B2Dec 15, 2015
Semiconductor package including stacked memory chips
KWON HEUNGKYU4 citations69
US9390992B2Jul 12, 2016
Semiconductor packages including a metal layer between first and second semiconductor chips
KWON HEUNGKYU1 citations45