Inventor · disambiguated record
Teng-Yen Huang
Also filed as: HUANG TENG · HUANG TENG-YEN
18 granted patents·7 pending applications·22 citations·filing 2003–2025
88Inventor score
Top patents by PatentIndex Score
25 records- 0185US11038060B2Semiconductor device with embedded sigma-shaped structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Jun 15, 2021·4 cites·12 claims
- 0281US12255161B2Semiconductor device with composite conductive features and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Granted Mar 18, 2025·0 cites·15 claims
- 0381US12218087B2Semiconductor device with composite conductive features and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Granted Feb 4, 2025·0 cites·12 claims
- 0477US6998205B2Optical proximity correction methodNANYA TECHNOLOGY CORP·Filed 2003·Granted Feb 14, 2006·16 cites·19 claims
- 0573US12002772B2Semiconductor device with composite conductive features and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2022·Granted Jun 4, 2024·0 cites·14 claims
- 0668US12362223B2Semiconductor structure, fabrication method and three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·18 claims
- 0768US7919216B2Mask and design method thereofNANYA TECHNOLOGY CORP·Filed 2008·Granted Apr 5, 2011·2 cites·10 claims
- 0867US11824004B2Method for fabricating semiconductor device structure with manganese-containing conductive plugNANYA TECHNOLOGY CORP·Filed 2022·Granted Nov 21, 2023·0 cites·15 claims
- 0965US11810977B2Semiconductor device with embedded sigma-shaped structureNANYA TECHNOLOGY CORP·Filed 2021·Granted Nov 7, 2023·0 cites·6 claims
- 1065US11581267B2Method for fabricating semiconductor device with protection structure and air gapsNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 14, 2023·0 cites·5 claims
- 1165US11488905B2Semiconductor device structure with manganese-containing conductive plug and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Nov 1, 2022·0 cites·13 claims
- 1263US11152311B1Semiconductor device with protection structure and air gaps and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Oct 19, 2021·0 cites·4 claims
- 1362US2025324603A1Semiconductor devices and fabricating methods thereof and memoriesYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1459US12376307B2Semiconductor structure, fabrication method and three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1556US2023307544A1Semiconductor device with embedded sigma-shaped structureNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1652US12324198B2Semiconductor device and manufacture method thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1752US10636911B1Fin structure and method for manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Apr 28, 2020·0 cites·6 claims
- 1851US11164823B2Semiconductor device with crack-detecting structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Nov 2, 2021·0 cites·19 claims
- 1947US2009268187A1Exposure systemHUANG TENG-YEN·Filed 2008·Application pending·0 cites
- 2045US2010068630A1Method for manufacturing photo maskLIN CHIA-WEI·Filed 2008·Application pending·0 cites
- 2144US2009225390A1Feedback system and feedback method for controlling power ratio of incident lightLIN CHIA-WEI·Filed 2008·Application pending·0 cites
- 2238US6929902B2Method of preventing repeated collapse in a reworked photoresist layerNANYA TECHNOLOGY CORP·Filed 2003·Granted Aug 16, 2005·0 cites·12 claims
- 2338US2013080981A1Method for improving optical proximity simulation from exposure resultHUANG TENG-YEN·Filed 2011·Application pending·0 cites
- 2437US2004079729A1Process for etching metal layerNANYA TECHNOLOGY CORP·Filed 2003·Application pending·0 cites
- 2535US7090965B2Method for enhancing adhesion between reworked photoresist and underlying oxynitride filmNANYA TECHNOLOGY CORP·Filed 2003·Granted Aug 15, 2006·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →