Inventor · disambiguated record
Yutaka Kitajima
Also filed as: KITAJIMA YUTAKA
7 granted patents·15 pending applications·41 citations·filing 2004–2024
78Inventor score
Top patents by PatentIndex Score
22 records- 0194US9375900B2Laminated glass and its production processASAHI GLASS CO LTD·Filed 2013·Granted Jun 28, 2016·34 cites·16 claims
- 0278US8033138B2Method and apparatus for bending a glass sheetASAHI GLASS CO LTD·Filed 2006·Granted Oct 11, 2011·4 cites·8 claims
- 0376US2025083616A1Glass for vehicles and camera unitAGC INC·Filed 2024·Application pending·0 cites
- 0473US8468850B2Bending method for a glass plate and bending apparatus for a glass plateFUKAMI MASAO·Filed 2010·Granted Jun 25, 2013·3 cites·13 claims
- 0568US12194927B2Glass for vehicles and camera unitAGC INC·Filed 2022·Granted Jan 14, 2025·0 cites·17 claims
- 0657US2024332080A1Manufacturing method of substrate unit, and substrate unitOKI ELECTRIC IND CO LTD·Filed 2024·Application pending·0 cites
- 0757US2024332454A1Electronic structure, manufacturing method of electronic structure, and manufacturing method of electronic deviceOKI ELECTRIC IND CO LTD·Filed 2024·Application pending·0 cites
- 0855US2024145620A1Manufacturing method of electronic deviceOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 0953US8387415B2Method for bending a glass sheet and apparatus for bending a glass sheetFUKAMI MASAO·Filed 2009·Granted Mar 5, 2013·0 cites·6 claims
- 1053US2023320217A1Piezoelectric-body film joint substrate and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 1153US2023320224A1Piezoelectric-body film joint substrate and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 1252US2024145239A1Manufacturing method of semiconductor element, semiconductor layer support structure, and semiconductor substrateOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 1352US2024145631A1Manufacturing method of semiconductor element, semiconductor layer support structure, and semiconductor substrateOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 1452US2023320228A1Piezoelectric film integrated device, manufacturing method thereof, and acoustic oscillation sensorOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 1552US2023320219A1Piezoelectric film integrated device, manufacturing method thereof, and acoustic oscillation sensorOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 1650US2021387386A1Multi-layered sheet and transfer materialHARIMA CHEMICALS INC·Filed 2019·Application pending·0 cites
- 1750US2014093702A1Method for producing laminated glass, and laminated glassASAHI GLASS CO LTD·Filed 2013·Application pending·0 cites
- 1848US2005138967A1Method for bending a glass sheet and apparatus thereforASAHI GLASS CO LTD·Filed 2004·Application pending·0 cites
- 1947US9546234B2Metal fine particle dispersant, metal fine particle dispersion liquid, and cured filmHARIMA CHEMICALS INC·Filed 2014·Granted Jan 17, 2017·0 cites·7 claims
- 2042US8381547B2Air-cooling/tempering apparatus for glass sheet, and air-cooling/tempering methodASAHI GLASS CO LTD·Filed 2011·Granted Feb 26, 2013·0 cites·8 claims
- 2142US2015202854A1Laminated glass production methodASAHI GLASS CO LTD·Filed 2015·Application pending·0 cites
- 2234US2022009134A1Hard coating layer-laminated mold resin and method of producing the sameHARIMA CHEMICALS INC·Filed 2019·Application pending·0 cites
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