Inventor · disambiguated record
Richard Alfred Beaupre
Also filed as: BEAUPRE RICHARD A · BEAUPRE RICHARD ALFRED
24 granted patents·6 pending applications·389 citations·filing 2004–2014
96Inventor score
Files withGEN ELECTRIC17BEAUPRE RICHARD ALFRED7DELGADO ELADIO CLEMENTE4GOWDA ARUN VIRUPAKSHA1SMOLENSKI JOSEPH LUCIAN1
Top patents by PatentIndex Score
30 records- 0196US7262444B2Power semiconductor packaging method and structureGEN ELECTRIC·Filed 2005·Granted Aug 28, 2007·50 cites·21 claims
- 0293US8358000B2Double side cooled power module with power overlayGEN ELECTRIC·Filed 2009·Granted Jan 22, 2013·48 cites·23 claims
- 0392US7898807B2Methods for making millichannel substrate, and cooling device and apparatus using the substrateGEN ELECTRIC·Filed 2009·Granted Mar 1, 2011·25 cites·14 claims
- 0492US7642449B2Photovoltaic integrated building componentGEN ELECTRIC·Filed 2004·Granted Jan 5, 2010·68 cites·28 claims
- 0591US8076696B2Power module assembly with reduced inductanceBEAUPRE RICHARD ALFRED·Filed 2009·Granted Dec 13, 2011·24 cites·19 claims
- 0689US8232637B2Insulated metal substrates incorporating advanced coolingBEAUPRE RICHARD ALFRED·Filed 2009·Granted Jul 31, 2012·20 cites·8 claims
- 0788US8049338B2Power semiconductor module and fabrication methodGEN ELECTRIC·Filed 2006·Granted Nov 1, 2011·14 cites·22 claims
- 0885US8929071B2Low cost manufacturing of micro-channel heatsinkBEAUPRE RICHARD ALFRED·Filed 2008·Granted Jan 6, 2015·13 cites·22 claims
- 0985US8466007B2Power semiconductor module and fabrication methodDELGADO ELADIO CLEMENTE·Filed 2011·Granted Jun 18, 2013·7 cites·4 claims
- 1085US7817422B2Heat sink and cooling and packaging stack for press-packagesGEN ELECTRIC·Filed 2008·Granted Oct 19, 2010·15 cites·22 claims
- 1183US8675379B2Power converting apparatus having improved electro-thermal characteristicsSMOLENSKI JOSEPH LUCIAN·Filed 2011·Granted Mar 18, 2014·10 cites·10 claims
- 1283US8487416B2Coaxial power moduleDELGADO ELADIO CLEMENTE·Filed 2011·Granted Jul 16, 2013·7 cites·18 claims
- 1382US7518236B2Power circuit package and fabrication methodGEN ELECTRIC·Filed 2005·Granted Apr 14, 2009·11 cites·21 claims
- 1482US7327024B2Power module, and phase leg assemblyGEN ELECTRIC·Filed 2004·Granted Feb 5, 2008·33 cites·27 claims
- 1578US8257102B2Busbar electrical power connectorDELGADO ELADIO CLEMENTE·Filed 2010·Granted Sep 4, 2012·10 cites·22 claims
- 1678US7829386B2Power semiconductor packaging method and structureGEN ELECTRIC·Filed 2007·Granted Nov 9, 2010·8 cites·27 claims
- 1777US8310040B2Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereofBEAUPRE RICHARD ALFRED·Filed 2010·Granted Nov 13, 2012·4 cites·11 claims
- 1875US8586421B2Method of forming semiconductor device package having high breakdown voltage and low parasitic inductanceBEAUPRE RICHARD ALFRED·Filed 2012·Granted Nov 19, 2013·3 cites·20 claims
- 1973US8982558B2Cooling device for a power module, and a related method thereofBEAUPRE RICHARD ALFRED·Filed 2011·Granted Mar 17, 2015·4 cites·10 claims
- 2071US7915944B2Gate drive circuitry for non-isolated gate semiconductor devicesGEN ELECTRIC·Filed 2009·Granted Mar 29, 2011·6 cites·21 claims
- 2170US7919714B2System and a method for controlling flow of solderGEN ELECTRIC·Filed 2007·Granted Apr 5, 2011·2 cites·12 claims
- 2269US8772634B2Busbar for power conversion applicationsBEAUPRE RICHARD ALFRED·Filed 2011·Granted Jul 8, 2014·4 cites·26 claims
- 2357US8622754B2Flexible power connectorDELGADO ELADIO CLEMENTE·Filed 2011·Granted Jan 7, 2014·3 cites·18 claims
- 2453US8853550B2Circuit board including mask for controlling flow of solderGOWDA ARUN VIRUPAKSHA·Filed 2011·Granted Oct 7, 2014·0 cites·4 claims
- 2547US2010302734A1Heatsink and method of fabricating sameGEN ELECTRIC·Filed 2009·Application pending·0 cites
- 2647US2008054298A1Power module with laminar interconnectGEN ELECTRIC·Filed 2007·Application pending·0 cites
- 2746US2010175857A1Millichannel heat sink, and stack and apparatus using the sameGEN ELECTRIC·Filed 2009·Application pending·0 cites
- 2844US2010038774A1Advanced and integrated cooling for press-packagesGEN ELECTRIC·Filed 2008·Application pending·0 cites
- 2942US2015236151A1Silicon carbide semiconductor devices, and methods for manufacturing thereofGEN ELECTRIC·Filed 2014·Application pending·0 cites
- 3037US2008042636A1System and method for current sensingGEN ELECTRIC·Filed 2006·Application pending·0 cites
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