Inventor · disambiguated record
Yuuji Suzuki
Also filed as: SUZUKI YUUJI
24 granted patents·11 pending applications·290 citations·filing 1986–2019
96Inventor score
Files withFURUKAWA ELECTRIC CO LTD10FURUKAWA CIRCUIT FOIL3SUNTORY HOLDINGS LTD3FANUC CORP2SUZUKI YUUJI2
Top patents by PatentIndex Score
35 records- 0195US10518938B2ContainerSUNTORY HOLDINGS LTD·Filed 2016·Granted Dec 31, 2019·28 cites·11 claims
- 0291US7381475B2Treated copper foil and circuit boardFURUKAWA CIRCUIT FOIL·Filed 2005·Granted Jun 3, 2008·22 cites·14 claims
- 0390US9078341B2Display deviceJAPAN DISPLAY INC·Filed 2013·Granted Jul 7, 2015·7 cites·5 claims
- 0487US9016679B2Sheet processing apparatus and image forming systemKUNIEDA AKIRA·Filed 2013·Granted Apr 28, 2015·6 cites·8 claims
- 0587US6924043B2Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrierFURKAWA CIRCUIT FOIL CO LTD·Filed 2003·Granted Aug 2, 2005·26 cites·21 claims
- 0686US9102117B2Sheet processing apparatus, image forming system, and sheet folding methodSUZUKI YUUJI·Filed 2013·Granted Aug 11, 2015·11 cites·20 claims
- 0786US7985485B2Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFURUKAWA ELECTRIC CO LTD·Filed 2009·Granted Jul 26, 2011·3 cites·7 claims
- 0883US7771841B2Ultrathin copper foil with carrier and printed circuit board using sameFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Aug 10, 2010·12 cites·6 claims
- 0981US8153273B2Surface treated electrodeposited copper foil and circuit boardSAITO TAKAHIRO·Filed 2007·Granted Apr 10, 2012·2 cites·4 claims
- 1073US7976956B2Laminated circuit boardFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Jul 12, 2011·6 cites·3 claims
- 1173US7223481B2Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit boardFURUKAWA CIRCUIT FOIL CO INC·Filed 2004·Granted May 29, 2007·19 cites·21 claims
- 1273US6312400B1Air expandable bodies reciprocating a massage elementTOSHIBA TEC KK·Filed 1999·Granted Nov 6, 2001·63 cites·9 claims
- 1371US6944280B2Gateway system having a redundant structure of media gateway controllersNEC CORP·Filed 2001·Granted Sep 13, 2005·12 cites·8 claims
- 1466US7985488B2Ultrathin copper foil with carrier and printed circuit board using sameFURUKAWA ELECTRIC CO LTD·Filed 2010·Granted Jul 26, 2011·2 cites·4 claims
- 1564US7215235B2Conductive substrate with resistance layer, resistance board, and resistance circuit boardFURUKAWA CIRCUIT FOIL·Filed 2004·Granted May 8, 2007·6 cites·10 claims
- 1664US5614328AReflow-plated member and a manufacturing method thereforFURUKAWA ELECTRIC CO LTD·Filed 1995·Granted Mar 25, 1997·30 cites·9 claims
- 1761US11254001B2Controller, control system and ladder programFANUC CORP·Filed 2019·Granted Feb 22, 2022·0 cites·5 claims
- 1861US4725860AInk carrier film in use with ink jet recording deviceTOSHIBA KK·Filed 1986·Granted Feb 16, 1988·11 cites·21 claims
- 1959US7275795B2Braking system of hybrid vehicleNISSAN DIESEL MOTOR CO·Filed 2003·Granted Oct 2, 2007·13 cites·6 claims
- 2058US7078928B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2003·Granted Jul 18, 2006·8 cites·8 claims
- 2157US7892655B2Ultrathin copper foil with carrier and printed circuit board using sameFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Feb 22, 2011·0 cites·6 claims
- 2249US6939400B2Ink, production method of the same materials for producing the same and printed matter with the sameTEIKOKU PRINTING MFG CO LTD·Filed 2003·Granted Sep 6, 2005·2 cites·14 claims
- 2345US10160119B2Robot systemFANUC CORP·Filed 2017·Granted Dec 25, 2018·0 cites·5 claims
- 2445US2007228443A1Conductive base material with thin film resistance layer, method of production of conductive base material with thin film resistance layer, and circuit board with thin film resistance layerFURUKAWA ELECTRIC CO LTD·Filed 2007·Application pending·0 cites
- 2544US7794578B2Method for preparing a circuit board material having a conductive base and a resistance layerFURUKAWA ELECTRIC CO LTD·Filed 2003·Granted Sep 14, 2010·1 cites·7 claims
- 2644US2020062573A1Pump mechanism and beverage dispenserSUNTORY HOLDINGS LTD·Filed 2017·Application pending·0 cites
- 2743US2007048507A1Laminated circuit boardFURUKAWA ELECTRIC CO LTD·Filed 2006·Application pending·0 cites
- 2842US2005280498A1Conductive base material with resistance layer and circuit board material with resistance layerKIKUCHI YUUKI·Filed 2005·Application pending·0 cites
- 2940US2006088723A1Surface treated copper foil and circuit boardSUZUKI YUUJI·Filed 2005·Application pending·0 cites
- 3040US2011171486A1Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFURUKAWA ELECTRIC CO LTD·Filed 2011·Application pending·0 cites
- 3139US2009289492A1Static Crushing Method, Aid for Static Crushing Used for the Crushing Method, and Filling ToolSUMITOMO OSAKA CEMENT CO LTD·Filed 2006·Application pending·0 cites
- 3238US2018065838A1Liquid dispenserSUNTORY HOLDINGS LTD·Filed 2016·Application pending·0 cites
- 3338US2006147742A1Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foilMATSUDA AKIRA·Filed 2004·Application pending·0 cites
- 3436US2007042212A1Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFURUKAWA CIRCUIT FOIL·Filed 2006·Application pending·0 cites
- 3530US2005019599A1Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFiled 2004·Application pending·0 cites
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