Inventor · disambiguated record
Raiyomand Aspandiar
Also filed as: ASPANDIAR RAIYOMAND · ASPANDIAR RAIYOMAND F
20 granted patents·3 pending applications·265 citations·filing 2001–2021
95Inventor score
Files withINTEL CORP23
Top patents by PatentIndex Score
23 records- 0191US6501658B2Heatsink mounting with shock absorbersINTEL CORP·Filed 2001·Granted Dec 31, 2002·75 cites·17 claims
- 0287US6734371B2Soldered heat sink anchor and method of useINTEL CORP·Filed 2001·Granted May 11, 2004·36 cites·24 claims
- 0386US11894474B2Silicon photonic integrated lens compatible with wafer processingINTEL CORP·Filed 2019·Granted Feb 6, 2024·5 cites·11 claims
- 0478US7183496B2Soldered heat sink anchor and method of useINTEL CORP·Filed 2004·Granted Feb 27, 2007·18 cites·15 claims
- 0573US6801436B2Extension mechanism and method for assembling overhanging componentsINTEL CORP·Filed 2001·Granted Oct 5, 2004·14 cites·11 claims
- 0673US6764325B2Zero insertion force heat-activated retention pinINTEL CORP·Filed 2002·Granted Jul 20, 2004·17 cites·29 claims
- 0770US6700800B2Retainer for circuit board assembly and method for using the sameINTEL CORP·Filed 2002·Granted Mar 2, 2004·15 cites·9 claims
- 0870US6472612B2Printed circuit board with embedded thermocouple junctionsINTEL CORP·Filed 2001·Granted Oct 29, 2002·17 cites·25 claims
- 0969US11715928B2Decoupling layer to reduce underfill stress in semiconductor devicesINTEL CORP·Filed 2019·Granted Aug 1, 2023·1 cites·20 claims
- 1068US6791035B2Interposer to couple a microelectronic device package to a circuit boardINTEL CORP·Filed 2002·Granted Sep 14, 2004·11 cites·21 claims
- 1167US7251880B2Method and structure for identifying lead-free solderINTEL CORP·Filed 2001·Granted Aug 7, 2007·12 cites·29 claims
- 1267US6875931B2Retainer for circuit board assembly and method for using the sameINTEL CORP·Filed 2002·Granted Apr 5, 2005·14 cites·21 claims
- 1358US6651869B2Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave solderingINTEL CORP·Filed 2001·Granted Nov 25, 2003·7 cites·32 claims
- 1455US6791189B2Epoxy washer for retention of inverted SMT componentsINTEL CORP·Filed 2002·Granted Sep 14, 2004·5 cites·18 claims
- 1555US6691407B2Methods for retaining assembled componentsINTEL CORP·Filed 2001·Granted Feb 17, 2004·5 cites·14 claims
- 1654US6917524B2Extension mechanism and method for assembling overhanging componentsINTEL CORP·Filed 2004·Granted Jul 12, 2005·4 cites·13 claims
- 1753US7131193B2Heat-shrinkable retainer for PCB double-sided assemblyINTEL CORP·Filed 2004·Granted Nov 7, 2006·3 cites·16 claims
- 1849US6906268B2Heat-shrinkable retainer for PCB double-sided assemblyINTEL CORP·Filed 2001·Granted Jun 14, 2005·2 cites·26 claims
- 1945US6552275B2Surface mount componentINTEL CORP·Filed 2001·Granted Apr 22, 2003·4 cites·20 claims
- 2045US2023084375A1Selective protection of integrated circuit chip surface regions from underfill contactINTEL CORP·Filed 2021·Application pending·0 cites
- 2143US2022416503A1Multiple metal layers within a photonics integrated circuit for thermal transferINTEL CORP·Filed 2021·Application pending·0 cites
- 2240US2004003496A1Interposer to couple a microelectronic device package to a circuit boardINTEL CORP·Filed 2003·Application pending·0 cites
- 2338US10356912B2Apparatus and method for conformal coating of integrated circuit packagesINTEL CORP·Filed 2016·Granted Jul 16, 2019·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →