Inventor · disambiguated record
Hironari Ohkubo
Also filed as: OHKUBO HIRONARI
11 granted patents·18 citations·filing 2012–2022
82Inventor score
Top patents by PatentIndex Score
11 records- 0189US9724783B2Laser processing apparatusDISCO CORP·Filed 2015·Granted Aug 8, 2017·10 cites·3 claims
- 0283US9870961B2Wafer processing methodDISCO CORP·Filed 2016·Granted Jan 16, 2018·5 cites·1 claims
- 0367US10668569B2Laser processing apparatusDISCO CORP·Filed 2016·Granted Jun 2, 2020·1 cites·8 claims
- 0467US8957347B2Method of detecting condensing spot position in laser beam processing apparatusYOSHIKAWA TOSHIYUKI·Filed 2012·Granted Feb 17, 2015·2 cites·1 claims
- 0550US12296402B2Laser processing apparatusDISCO CORP·Filed 2021·Granted May 13, 2025·0 cites·17 claims
- 0650US12236619B2Processing apparatusDISCO CORP·Filed 2022·Granted Feb 25, 2025·0 cites·2 claims
- 0744US11462439B2Wafer processing methodDISCO CORP·Filed 2020·Granted Oct 4, 2022·0 cites·4 claims
- 0839US10211104B2Processing method of package waferDISCO CORP·Filed 2017·Granted Feb 19, 2019·0 cites·4 claims
- 0934US11476137B2Dividing apparatus including an imaging unit for detecting defects in a workplaceDISCO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·4 claims
- 1034US9779994B2Wafer processing methodDISCO CORP·Filed 2016·Granted Oct 3, 2017·0 cites·1 claims
- 1132US10207362B2Laser processing apparatusDISCO CORP·Filed 2016·Granted Feb 19, 2019·0 cites·4 claims
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