Inventor · disambiguated record
Woo Jin Jang
Also filed as: JANG WOO JIN
20 granted patents·7 pending applications·83 citations·filing 2005–2022
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15PANTECH CO LTD4JANG WOO-JIN2SAMSUNG SDI CO LTD2LEE KYOUNG WOO1
Top patents by PatentIndex Score
27 records- 0190US8232200B1Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed therebyOH HYEOK-SANG·Filed 2011·Granted Jul 31, 2012·21 cites·20 claims
- 0287US8371551B2Apparatus for adjusting level of refrigeratorLG ELECTRONICS INC·Filed 2008·Granted Feb 12, 2013·18 cites·17 claims
- 0381US10720447B2Integrated circuit memory devices having impurity-doped dielectric regions therein and methods of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 21, 2020·2 cites·11 claims
- 0481US10411034B2Integrated circuit memory devices having impurity-doped dielectric regions therein and methods of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·2 cites·20 claims
- 0580US9500407B2Apparatus and method for dryingSAMSUNG SDI CO LTD·Filed 2014·Granted Nov 22, 2016·2 cites·13 claims
- 0676US7879720B2Methods of forming electrical interconnects using electroless plating techniques that inhibit void formationSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 1, 2011·7 cites·18 claims
- 0775US9281240B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 8, 2016·3 cites·20 claims
- 0875US8993436B2Method for fabricating semiconductor device that includes forming passivation film along side wall of via holeSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 31, 2015·4 cites·19 claims
- 0974US10359799B2Bandgap reference voltage generation circuit and bandgap reference voltage generation systemSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 23, 2019·2 cites·20 claims
- 1073US7577115B2Apparatus and method for acquiring code group in asynchronous W-CDMA systemSKY TELETECH CO LTD·Filed 2005·Granted Aug 18, 2009·6 cites·5 claims
- 1170US7282801B2Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chipSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 16, 2007·6 cites·16 claims
- 1268US8697455B2Monitoring test element groups (TEGs) for etching process and methods of manufacturing a semiconductor device using the sameLEE KYOUNG-WOO·Filed 2012·Granted Apr 15, 2014·2 cites·20 claims
- 1368US7869489B2Apparatus and method for acquirying a preamble in an orthogonal frequency division multiple access mobile terminalPANTECH CO LTD·Filed 2007·Granted Jan 11, 2011·3 cites·16 claims
- 1465US9900020B2Digital/analog converter and communication device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 20, 2018·2 cites·19 claims
- 1562US7876731B2Method and apparatus for acquiring code group in asynchronous wideband code division multiple access system using receiver diversityPANTECH CO LTD·Filed 2005·Granted Jan 25, 2011·2 cites·11 claims
- 1661US8373273B2Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Feb 12, 2013·1 cites·5 claims
- 1756US10195638B2Apparatus for coating a separator having collection chamber and method for coating the separatorSAMSUNG SDI CO LTD·Filed 2014·Granted Feb 5, 2019·0 cites·14 claims
- 1853US2023099844A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1952US10303197B2Terminal device including reference voltage circuitSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 28, 2019·0 cites·20 claims
- 2048US8272703B2Home-bar door and the manufacturing methodJANG WOO JIN·Filed 2008·Granted Sep 25, 2012·0 cites·4 claims
- 2146US11018685B2Analog-to-digital converter and method of performing analog-to-digital conversionSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·0 cites·20 claims
- 2246US2010099250A1Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier LayersSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2346US2011080902A1Apparatus and method for acquiring a preamble in an orthogonal frequency division multiple access mobile terminalPANTECH CO LTD·Filed 2010·Application pending·0 cites
- 2443US2008298292A1Wireless Broadband Mobile Station and Method for Measuring Preamble and Determining Effective Sleep PeriodPANTECH CO LTD·Filed 2006·Application pending·0 cites
- 2542US2007080453A1Semiconductor chip having a bump with conductive particles and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2637US2008012592A1Device and method for testing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2736US2007210450A1Method of forming a bump and a connector structure having the bumpJANG WOO-JIN·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →