Inventor · disambiguated record
Seung-Hyun Baik
Also filed as: BAIK SEUNG HYUN
7 granted patents·6 pending applications·21 citations·filing 2008–2024
78Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8BAIK SEUNG HYUN1CHUNG JAE-WOO1LSIS CO LTD1SAMSUNG ELECTRO MECH1
Top patents by PatentIndex Score
13 records- 0192US9969893B2Aqueous compositions, methods of producing conductive thin films using the same, conductive thin films produced thereby, and electronic devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 15, 2018·11 cites·22 claims
- 0286US9070824B2Heterogeneous laminate including graphene, and thermoelectric material, thermoelectric module, and thermoelectric apparatus including the heterogeneous laminateSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jun 30, 2015·5 cites·28 claims
- 0374US9418769B2Conductive carbon nanotube-metal composite inkCHUNG JAE-WOO·Filed 2010·Granted Aug 16, 2016·3 cites·10 claims
- 0468US9570207B2Electrical contact materials and method for preparing the sameLSIS CO LTD·Filed 2014·Granted Feb 14, 2017·2 cites·2 claims
- 0558US10024585B2Heat radiation-thermoelectric fin, and thermoelectric module and thermoelectric apparatus including the heat radiation-thermoelectric finSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 17, 2018·0 cites·14 claims
- 0658US2025087599A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0748US2024203940A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0847US2009114425A1Conductive paste and printed circuit board using the sameUNIV SUNGKYUNKWAN·Filed 2008·Application pending·0 cites
- 0947US2009083975A1Method of interconnecting layers of a printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1041US2022328753A1Power factor improvement and power generation apparatus using piezoelectric elementBAIK SEUNG HYUN·Filed 2020·Application pending·0 cites
- 1138US2014230868A1Graphene-containing composite laminate, thermoelectric material, and thermoelectric device including the thermoelectric materialSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1234US9871180B2Thermoelectric material and thermoelectric device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 16, 2018·0 cites·21 claims
- 1333US9773752B2Printed circuit boards and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 26, 2017·0 cites·19 claims
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