Inventor · disambiguated record
Yuya Kitagawa
Also filed as: KITAGAWA YUYA
12 granted patents·6 pending applications·17 citations·filing 2011–2022
84Inventor score
Top patents by PatentIndex Score
18 records- 0193US10276855B2Method of manufacturing a lithium-ion secondary battery electrode sheet based on an active material dry powderTOYOTA MOTOR CO LTD·Filed 2015·Granted Apr 30, 2019·7 cites·16 claims
- 0290US11145988B2Electromagnetic wave absorberNITTO DENKO CORP·Filed 2016·Granted Oct 12, 2021·3 cites·11 claims
- 0386US10701848B2Electromagnetic wave absorber and molded article equipped with electromagnetic wave absorberNITTO DENKO CORP·Filed 2016·Granted Jun 30, 2020·4 cites·15 claims
- 0483US10854872B2Method for manufacturing electrode for lithium ion secondary cellZEON CORP·Filed 2015·Granted Dec 1, 2020·2 cites·5 claims
- 0569US9796828B2Epoxy resin composition and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Oct 24, 2017·1 cites·12 claims
- 0664US12378502B2Softening agentKAO CORP·Filed 2022·Granted Aug 5, 2025·0 cites·10 claims
- 0759US12116545B2Lubricating agentKAO CORP·Filed 2021·Granted Oct 15, 2024·0 cites·15 claims
- 0859US11472165B2Plate-like composite materialNITTO DENKO CORP·Filed 2019·Granted Oct 18, 2022·0 cites·4 claims
- 0956US12275915B2Fragrance compositionKAO CORP·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 1048US2022015275A1Electromagnetic wave absorberNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 1147US10388425B2Insulating resin material, metal layer-equipped insulating resin material using same, and wiring substrateNITTO DENKO CORP·Filed 2017·Granted Aug 20, 2019·0 cites·12 claims
- 1246US2015322244A1Vinyl chloride resin composition for powder molding, vinyl chloride resin molded article and laminateZEON CORP·Filed 2013·Application pending·0 cites
- 1345US10297815B2Method for producing electrode for lithium ion secondary batteriesZEON CORP·Filed 2015·Granted May 21, 2019·0 cites·3 claims
- 1444US10895230B2Fuel injection deviceDENSO CORP·Filed 2018·Granted Jan 19, 2021·0 cites·18 claims
- 1544US2018200985A1Fluororesin porous body, metal layer-equipped porous body using same, and wiring substrateNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1636US2011224333A1Resin composition for electronic component encapsulation and electronic component deviceNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1733US2013148304A1Epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the sameKITAGAWA YUYA·Filed 2012·Application pending·0 cites
- 1831US2013012619A1Epoxy resin composition for electronic component encapsulation and electronic component device using the sameNITTO DENKO CORP·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →