Inventor · disambiguated record
Ming-Ching Wu
Also filed as: WU MING C · WU MING-CHING
14 granted patents·16 pending applications·53 citations·filing 1989–2024
89Inventor score
Top patents by PatentIndex Score
30 records- 0190US10067014B1Force sensorGLOBALMEMS CO LTD·Filed 2017·Granted Sep 4, 2018·10 cites·11 claims
- 0284US8468888B2MEMS sensor capable of sensing acceleration and pressureWU MING-CHING·Filed 2010·Granted Jun 25, 2013·8 cites·14 claims
- 0374US11105692B2Force sensor having first and second circuit board arrangementsCORETRONIC MEMS CORP·Filed 2019·Granted Aug 31, 2021·2 cites·10 claims
- 0466US9815689B2Micro-electromechanical system (MEMS) carrierGLOBALMEMS TAIWAN CORPORATION LTD·Filed 2016·Granted Nov 14, 2017·2 cites·3 claims
- 0564US11506549B2Force sensorCORETRONIC MEMS CORP·Filed 2019·Granted Nov 22, 2022·1 cites·5 claims
- 0659US9417425B2Micro-electromechanical system (MEMS) carrierGLOBALMEMS TAIWAN CORP LTD·Filed 2014·Granted Aug 16, 2016·2 cites·13 claims
- 0759US5028445AProcess of forming simulated crustacean meatJAC CREATIVE FOODS INC·Filed 1989·Granted Jul 2, 1991·18 cites·10 claims
- 0857US9736593B1Electro-acoustic transducerGLOBALMEMS CO LTD·Filed 2016·Granted Aug 15, 2017·1 cites·6 claims
- 0956US9756428B1Electro-acoustic transducerGLOBALMEMS CO LTD·Filed 2016·Granted Sep 5, 2017·1 cites·6 claims
- 1056US2024365670A1Piezoelectric actuating apparatusCORETRONIC MEMS CORP·Filed 2024·Application pending·0 cites
- 1154US2023117559A1Sensing moduleCORETRONIC MEMS CORP·Filed 2022·Application pending·0 cites
- 1251US2023056353A1Micro scanning mirrorCORETRONIC MEMS CORP·Filed 2022·Application pending·0 cites
- 1351US2023062685A1Varaiable focal length optical elementCORETRONIC MEMS CORP·Filed 2022·Application pending·0 cites
- 1448US12274172B2Piezoelectric actuating apparatusCORETRONIC MEMS CORP·Filed 2022·Granted Apr 8, 2025·0 cites·16 claims
- 1545US2022066199A1Micro scanning mirrorCORETRONIC MEMS CORP·Filed 2021·Application pending·0 cites
- 1645US2007061826A1Micro-optical pickup headLITE ON IT CORP·Filed 2006·Application pending·0 cites
- 1743US8664029B2Process for fabricating a capacitance type tri-axial accelerometerWU MING-CHING·Filed 2009·Granted Mar 4, 2014·0 cites·14 claims
- 1841US4994366AShrimp analog forming processJAC CREATIVE FOODS INC·Filed 1989·Granted Feb 19, 1991·8 cites·13 claims
- 1941US2019339509A1Variable focal length optical elementCORETRONIC CORP·Filed 2019·Application pending·0 cites
- 2041US2015068307A1Resonance device having drop resistive protectionWU MING-CHING·Filed 2013·Application pending·0 cites
- 2139US8236605B2Method for separating semiconductor wafer into chipsWU MING-CHING·Filed 2010·Granted Aug 7, 2012·0 cites·5 claims
- 2239US2015068306A1Movable device having drop resistive protectionWU MING-CHING·Filed 2013·Application pending·0 cites
- 2337US2017219619A1AccelerometerGLOBALMEMS CO LTD·Filed 2016·Application pending·0 cites
- 2435US8443670B23-axis accelerometer with gap-closing capacitive electrodesHSU CHIA-PAO·Filed 2009·Granted May 21, 2013·0 cites·14 claims
- 2535US2012056280A1MEMS Sensor PackageWU MING-CHING·Filed 2010·Application pending·0 cites
- 2633US2018376251A1Electro-acoustic transducerGLOBALMEMS CO LTD·Filed 2017·Application pending·0 cites
- 2733US2017233248A1Micro sensor and manufacturing method thereofGLOBALMEMS CO LTD·Filed 2016·Application pending·0 cites
- 2833US2017234744A1Mems force sensor and force sensing apparatusGLOBALMEMS CO LTD·Filed 2016·Application pending·0 cites
- 2930US2011140210A1Microelectromechanical sensor device package and method for making the sameDOMINTECH CO LTD·Filed 2010·Application pending·0 cites
- 3030US2013213698A1Holder for semiconductor packageBIAR JEFF·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →