Inventor · disambiguated record
Lawrence E. Felton
Also filed as: FELTON LAWRENCE · FELTON LAWRENCE E
17 granted patents·9 pending applications·517 citations·filing 2000–2011
95Inventor score
Top patents by PatentIndex Score
26 records- 0196US7357017B2Wafer level capped sensorANALOG DEVICES INC·Filed 2007·Granted Apr 15, 2008·42 cites·7 claims
- 0292US7275424B2Wafer level capped sensorANALOG DEVICES INC·Filed 2005·Granted Oct 2, 2007·51 cites·13 claims
- 0392US7040922B2Multi-surface mounting member and electronic deviceANALOG DEVICES INC·Filed 2003·Granted May 9, 2006·104 cites·15 claims
- 0492US6936918B2MEMS device with conductive path through substrateANALOG DEVICES INC·Filed 2004·Granted Aug 30, 2005·78 cites·23 claims
- 0592US6352935B1Method of forming a cover cap for semiconductor wafer devicesANALOG DEVICES INC·Filed 2000·Granted Mar 5, 2002·84 cites·29 claims
- 0687US7795723B2Capped sensorANALOG DEVICES INC·Filed 2005·Granted Sep 14, 2010·13 cites·13 claims
- 0783US7166911B2Packaged microchip with premolded-type packageANALOG DEVICES INC·Filed 2004·Granted Jan 23, 2007·42 cites·21 claims
- 0883US6759273B2Method and device for protecting micro electromechanical systems structures during dicing of a waferANALOG DEVICES INC·Filed 2001·Granted Jul 6, 2004·20 cites·48 claims
- 0979US6893574B2MEMS capping method and apparatusANALOG DEVICES INC·Filed 2001·Granted May 17, 2005·31 cites·14 claims
- 1063US6940636B2Optical switching apparatus and method of assembling sameANALOG DEVICES INC·Filed 2001·Granted Sep 6, 2005·11 cites·15 claims
- 1162US6964882B2Fabricating complex micro-electromechanical systems using a flip bonding techniqueANALOG DEVICES INC·Filed 2002·Granted Nov 15, 2005·11 cites·9 claims
- 1262US6933163B2Fabricating integrated micro-electromechanical systems using an intermediate electrode layerANALOG DEVICES INC·Filed 2002·Granted Aug 23, 2005·14 cites·7 claims
- 1362US6931170B2Fiber-attached optical devices with in-plane micromachined mirrorsANALOG DEVICES INC·Filed 2002·Granted Aug 16, 2005·8 cites·13 claims
- 1453US2010055412A1String With Refractory Metal Core For String Ribbon Crystal GrowthEVERGREEN SOLAR INC·Filed 2009·Application pending·0 cites
- 1552US2008225505A1Method of producing a MEMS deviceANALOG DEVICES INC·Filed 2008·Application pending·0 cites
- 1650US8343369B2Method of producing a MEMS deviceANALOG DEVICES INC·Filed 2011·Granted Jan 1, 2013·0 cites·20 claims
- 1750US7033672B2Static dissipation treatments for optical package windowsANALOG DEVICES INC·Filed 2002·Granted Apr 25, 2006·7 cites·13 claims
- 1849US2008150104A1Leadframe with different topologies for mems packageZIMMERMAN MICHAEL A·Filed 2007·Application pending·0 cites
- 1946US2007071268A1Packaged microphone with electrically coupled lidANALOG DEVICES INC·Filed 2006·Application pending·0 cites
- 2044US7338705B2Static dissipation treatments for optical package windowsANALOG DEVICES INC·Filed 2006·Granted Mar 4, 2008·1 cites·20 claims
- 2141US7521363B2MEMS device with non-standard profileANALOG DEVICES INC·Filed 2004·Granted Apr 21, 2009·0 cites·20 claims
- 2241US2007040231A1Partially etched leadframe packages having different top and bottom topologiesHARNEY KIERAN P·Filed 2006·Application pending·0 cites
- 2339US2005170609A1Conductive bond for through-wafer interconnectFiled 2005·Application pending·0 cites
- 2436US2005054133A1Wafer level capped sensorFiled 2003·Application pending·0 cites
- 2535US2005056870A1Stress sensitive microchip with premolded-type packageFiled 2004·Application pending·0 cites
- 2635US2004063237A1Fabricating complex micro-electromechanical systems using a dummy handling substrateFiled 2002·Application pending·0 cites
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