Inventor · disambiguated record
Axel Beyer
Also filed as: BEYER AXEL
8 granted patents·1 pending application·3 citations·filing 2018–2024
74Inventor score
Files withSILTRONIC AG9
Top patents by PatentIndex Score
9 records- 0177US12083705B2Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline siliconSILTRONIC AG·Filed 2019·Granted Sep 10, 2024·2 cites·11 claims
- 0276US12479128B2Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline siliconSILTRONIC AG·Filed 2024·Granted Nov 25, 2025·0 cites·7 claims
- 0371US12381074B2Method, control system, and system for machining a semiconductor wafer, and semiconductor waferSILTRONIC AG·Filed 2023·Granted Aug 5, 2025·0 cites·15 claims
- 0465US11158549B2Method, control system and plant for processing a semiconductor wafer, and semiconductor waferSILTRONIC AG·Filed 2018·Granted Oct 26, 2021·1 cites·14 claims
- 0552US11658022B2Method, control system, and system for machining a semiconductor wafer, and semiconductor waferSILTRONIC AG·Filed 2018·Granted May 23, 2023·0 cites·17 claims
- 0650US12311455B2Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processesSILTRONIC AG·Filed 2021·Granted May 27, 2025·0 cites·12 claims
- 0749US12479129B2Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processesSILTRONIC AG·Filed 2021·Granted Nov 25, 2025·0 cites·11 claims
- 0847US12325081B2Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processesSILTRONIC AG·Filed 2021·Granted Jun 10, 2025·0 cites·4 claims
- 0939US2022040883A1Method for producing semiconductor wafers by means of a wire sawSILTRONIC AG·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →