Inventor · disambiguated record
Chia-Min Lin
Also filed as: LIN CHIA-MIN
23 granted patents·6 pending applications·17 citations·filing 2013–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19INVENSENSE INC4NCKU RES AND DEVELOPMENT FOUNDATION2UNIV NAT CHENG KUNG2GLOBAL UNICHIP CORP1
Top patents by PatentIndex Score
29 records- 0187US12358194B2Molded semiconductor device and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0287US2025303621A1Molding apparatus and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0385US9581512B2Pressure sensor with deformable membrane and method of manufactureINVENSENSE INC·Filed 2014·Granted Feb 28, 2017·7 cites·17 claims
- 0484US2025132268A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0583US12011859B2Molding apparatus and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 0682US12512419B2Method of fabricating memory device and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0782US12218082B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0882US11075131B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·3 cites·20 claims
- 0981US2025309083A1Semiconductor structure and circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1079US11731327B2Molding apparatus and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 1177US12417969B2Semiconductor structure and circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 1275US9958349B2Pressure sensorINVENSENSE INC·Filed 2016·Granted May 1, 2018·2 cites·16 claims
- 1374US12230549B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1474US2025300130A1Manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1573US11855006B2Memory device, package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·17 claims
- 1672US2025167060A1Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1770US11594479B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 1869US9448122B2Multi-point temperature sensing method for integrated circuit chip and system of the sameUNIV NAT CHENG KUNG·Filed 2013·Granted Sep 20, 2016·2 cites·13 claims
- 1969US8966428B2Fixed-outline floorplanning approach for mixed-size modulesUNIV NAT CHENG KUNG·Filed 2013·Granted Feb 24, 2015·3 cites·8 claims
- 2064US12354997B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 8, 2025·0 cites·20 claims
- 2162US11446851B2Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 2262US11309226B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·0 cites·20 claims
- 2356US10816422B2Pressure sensorINVENSENSE INC·Filed 2017·Granted Oct 27, 2020·0 cites·20 claims
- 2455US10254185B2Pressure sensorINVENSENSE INC·Filed 2018·Granted Apr 9, 2019·0 cites·13 claims
- 2552US2015122041A1Pressure sensorSENSIRION AG·Filed 2014·Application pending·0 cites
- 2651US11810847B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 2750US11861283B2Placement method and non-transitory computer readable storage mediumGLOBAL UNICHIP CORP·Filed 2021·Granted Jan 2, 2024·0 cites·9 claims
- 2846US10769341B1Method of placing macro cells and a simulated-evolution-based macro refinement methodNCKU RES AND DEVELOPMENT FOUNDATION·Filed 2019·Granted Sep 8, 2020·0 cites·11 claims
- 2939US10372861B2Method of macro placement and a non-transitory computer readable medium thereofNCKU RES AND DEVELOPMENT FOUNDATION·Filed 2016·Granted Aug 6, 2019·0 cites·16 claims
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