Inventor · disambiguated record
Frederick Ray Gomez
Also filed as: GOMEZ FREDERICK RAY
7 granted patents·2 pending applications·20 citations·filing 2014–2024
79Inventor score
Files withST MICROELECTRONICS INC9
Top patents by PatentIndex Score
9 records- 0192US10388594B2Protection from ESD during the manufacturing process of semiconductor chipsST MICROELECTRONICS INC·Filed 2017·Granted Aug 20, 2019·10 cites·21 claims
- 0280US9258890B2Support structure for stacked integrated circuit diesST MICROELECTRONICS INC·Filed 2014·Granted Feb 9, 2016·8 cites·14 claims
- 0379US2025183135A1Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0479US2025183136A1Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0571US10672689B2Protection from ESD during the manufacturing process of semiconductor chipsST MICROELECTRONICS INC·Filed 2019·Granted Jun 2, 2020·1 cites·20 claims
- 0670US12094725B2Leadframe package with pre-applied filler materialST MICROELECTRONICS INC·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 0764US12211774B2Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2020·Granted Jan 28, 2025·0 cites·18 claims
- 0864US9578744B2Leadframe package with pre-applied filler materialST MICROELECTRONICS INC·Filed 2014·Granted Feb 21, 2017·1 cites·20 claims
- 0953US11227776B2Leadframe package with pre-applied filler materialST MICROELECTRONICS INC·Filed 2016·Granted Jan 18, 2022·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →