Inventor · disambiguated record
Mitsuaki Iwashita
Also filed as: IWASHITA MITSUAKI
57 granted patents·38 pending applications·391 citations·filing 1994–2025
98Inventor score
Top patents by PatentIndex Score
95 records- 0192US12444606B2Methods for forming vertically layered ionic liquid crystal (ILC) structures on a semiconductor substrateTOKYO ELECTRON LTD·Filed 2023·Granted Oct 14, 2025·2 cites·20 claims
- 0292US5722875AMethod and apparatus for polishingTOKYO ELECTRON LTD·Filed 1996·Granted Mar 3, 1998·133 cites·17 claims
- 0391US9255331B2Apparatus for plating processTOKYO ELECTRON LTD·Filed 2014·Granted Feb 9, 2016·9 cites·5 claims
- 0486US7989354B2Patterning methodTOKYO ELECTRON LTD·Filed 2008·Granted Aug 2, 2011·9 cites·30 claims
- 0585US9505019B2Plating apparatus, plating method and storage mediumINATOMI YUICHIRO·Filed 2012·Granted Nov 29, 2016·3 cites·8 claims
- 0684US6683006B2Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2002·Granted Jan 27, 2004·26 cites·5 claims
- 0783US6106369APolishing systemTOKYO ELECTRON LTD·Filed 1998·Granted Aug 22, 2000·68 cites·19 claims
- 0881US8372212B2Supercritical drying method and apparatus for semiconductor substratesTOSHIBA KK·Filed 2012·Granted Feb 12, 2013·5 cites·5 claims
- 0980US8465596B2Supercritical processing apparatus and supercritical processing methodTOSHIMA TAKAYUKI·Filed 2011·Granted Jun 18, 2013·5 cites·9 claims
- 1080US8168375B2Patterning methodNAKAJIMA SHIGERU·Filed 2008·Granted May 1, 2012·9 cites·25 claims
- 1180US8062955B2Substrate processing method and substrate processing apparatusTANAKA TAKASHI·Filed 2007·Granted Nov 22, 2011·6 cites·15 claims
- 1279US8771429B2Supercritical drying method for semiconductor substrate and supercritical drying apparatusJI LINAN·Filed 2012·Granted Jul 8, 2014·5 cites·8 claims
- 1375US6800546B2Film forming method by radiating a plasma on a surface of a low dielectric constant filmTOKYO ELECTRON LTD·Filed 2002·Granted Oct 5, 2004·20 cites·9 claims
- 1474US8937014B2Liquid treatment apparatus and liquid treatment methodTANAKA TAKASHI·Filed 2011·Granted Jan 20, 2015·3 cites·7 claims
- 1574US8691497B2Developing treatment methodINATOMI YUICHIRO·Filed 2010·Granted Apr 8, 2014·3 cites·12 claims
- 1673US10224208B2Plating method and recording mediumTOKYO ELECTRON LTD·Filed 2016·Granted Mar 5, 2019·2 cites·3 claims
- 1773US9583330B2Supercritical drying method for semiconductor substrate and supercritical drying apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Feb 28, 2017·2 cites·4 claims
- 1873US8383522B2Micro pattern forming methodTOKYO ELECTRON LTD·Filed 2011·Granted Feb 26, 2013·2 cites·18 claims
- 1971US12406862B2Vacuum processing apparatus and oxidizing gas removal methodTOKYO ELECTRON LTD·Filed 2023·Granted Sep 2, 2025·0 cites·3 claims
- 2071US6660124B1Polishing system and polishing methodTOKYO ELECTRON LTD·Filed 2000·Granted Dec 9, 2003·14 cites·7 claims
- 2170US12247768B2Electrocaloric effect element, heat transfer device, semiconductor manufacturing device, and electrocaloric effect element control methodTOKYO ELECTRON LTD·Filed 2021·Granted Mar 11, 2025·0 cites·17 claims
- 2269US11171050B2Method for manufacturing a contact pad, method for manufacturing a semiconductor device using same, and semiconductor deviceTOKYO ELECTRON LTD·Filed 2018·Granted Nov 9, 2021·1 cites·28 claims
- 2369US9421569B2Plating apparatus, plating method and storage mediumTANAKA TAKASHI·Filed 2012·Granted Aug 23, 2016·2 cites·6 claims
- 2468US7754622B2Patterning method utilizing SiBN and photolithographyTOKYO ELECTRON LTD·Filed 2008·Granted Jul 13, 2010·2 cites·11 claims
- 2567US9711363B2Plating method, recording medium and plating systemTOKYO ELECTRON LTD·Filed 2016·Granted Jul 18, 2017·1 cites·6 claims
- 2664US8999432B2Cap metal forming methodTANAKA TAKASHI·Filed 2009·Granted Apr 7, 2015·1 cites·3 claims
- 2763US12435426B2Substrate liquid processing apparatus and substrate liquid processing methodTOKYO ELECTRON LTD·Filed 2020·Granted Oct 7, 2025·0 cites·11 claims
- 2863US12417928B2Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2023·Granted Sep 16, 2025·0 cites·9 claims
- 2963US9966306B2Catalyst layer forming method, catalyst layer forming system and recording mediumTOKYO ELECTRON LTD·Filed 2016·Granted May 8, 2018·1 cites·13 claims
- 3062US10199240B2Substrate processing method, substrate processing apparatus, and storage mediumHAYASHI HIDEKAZU·Filed 2012·Granted Feb 5, 2019·1 cites·7 claims
- 3162US2025347002A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3261US2022403509A1Vacuum processing apparatus and oxidizing gas removal methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 3360US8003509B2Semiconductor manufacturing apparatus and semiconductor manufacturing methodTOKYO ELECTRON LTD·Filed 2009·Granted Aug 23, 2011·1 cites·11 claims
- 3459US12011738B2Substrate processing method and ionic liquidTOKYO ELECTRON LTD·Filed 2023·Granted Jun 18, 2024·0 cites·18 claims
- 3559US5622566AFilm-forming apparatusTOKYO ELECTRON LTD·Filed 1994·Granted Apr 22, 1997·32 cites·10 claims
- 3657US8168377B2Pattern forming method and method of manufacturing semiconductor device by using the sameMITSUOKA KAZUYUKI·Filed 2009·Granted May 1, 2012·1 cites·19 claims
- 3756US11004684B2Forming method of hard maskTOKYO ELECTRON LTD·Filed 2019·Granted May 11, 2021·0 cites·4 claims
- 3856US9487865B2Plating apparatus, plating method and storage mediumTOKYO ELECTRON LTD·Filed 2012·Granted Nov 8, 2016·0 cites·7 claims
- 3956US6120361APolishing apparatus, polishing memberTOKYO ELECTRON LTD·Filed 1998·Granted Sep 19, 2000·18 cites·13 claims
- 4056US2025191910A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4156US2025226228A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 4255US2010040980A1Method and apparatus for reforming film and controlling slimming amount thereofTOKYO ELECTON LTD·Filed 2009·Application pending·0 cites
- 4355US2023111710A1Purification processing apparatus, substrate processing system, and processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4454US7195936B2Thin film processing method and systemTOKYO ELECTRON LTD·Filed 2003·Granted Mar 27, 2007·4 cites·7 claims
- 4553US10224202B2Forming method of hard mask, forming apparatus of hard mask and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Mar 5, 2019·0 cites·6 claims
- 4652US9777379B2Plating apparatus, plating method and storage mediumINATOMI YUICHIRO·Filed 2012·Granted Oct 3, 2017·0 cites·4 claims
- 4752US9650717B2Pre-treatment method of plating, storage medium, and plating systemTOKYO ELECTRON LTD·Filed 2015·Granted May 16, 2017·0 cites·5 claims
- 4852US2014120264A1Plating apparatus, plating method and storage mediumINATOMI YUICHIRO·Filed 2012·Application pending·0 cites
- 4951US9731322B2Plating apparatus, plating method and storage medium having plating program stored thereonTANAKA TAKASHI·Filed 2011·Granted Aug 15, 2017·0 cites·1 claims
- 5051US9653354B2Metal wiring layer forming method, metal wiring layer forming apparatus, and recording mediumTOKYO ELECTRON LTD·Filed 2014·Granted May 16, 2017·0 cites·16 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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