Inventor · disambiguated record
Osamu Higashi
Also filed as: HIGASHI OSAMU
2 granted patents·2 pending applications·32 citations·filing 2003–2010
62Inventor score
Top patents by PatentIndex Score
4 records- 0188US8974116B2Heat sink for measuring temperature of electronic componentOKAMOTO TOMOMI·Filed 2010·Granted Mar 10, 2015·22 cites·8 claims
- 0260US6971571B2Reflow soldering apparatus and reflow soldering methodFUJITSU LTD·Filed 2003·Granted Dec 6, 2005·10 cites·10 claims
- 0335US2011072655A1Method of soldering an electronic componentFUJITSU LTD·Filed 2010·Application pending·0 cites
- 0435US2010223775A1Method for dismounting electronic deviceFUJITSU LTD·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →