Inventor · disambiguated record
Hyun-Soo Chung
Also filed as: CHUNG HYUN · CHUNG HYUN-SOO
61 granted patents·32 pending applications·501 citations·filing 1999–2024
98Inventor score
Files withSAMSUNG ELECTRONICS CO LTD57CHUNG HYUN-SOO8LX SEMICON CO LTD5IRE CHEMICAL LTD4SILICON WORKS CO LTD4
Top patents by PatentIndex Score
93 records- 0198US7598607B2Semiconductor packages with enhanced joint reliability and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 6, 2009·101 cites·14 claims
- 0295US8957526B2Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·19 cites·8 claims
- 0394US6713595B2Copolyester resin composition and a process of preparation thereofIRE CHEMICAL LTD·Filed 2000·Granted Mar 30, 2004·68 cites·15 claims
- 0493US10008462B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 26, 2018·12 cites·9 claims
- 0592US8952543B2Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devicesLEE HO-JIN·Filed 2012·Granted Feb 10, 2015·15 cites·25 claims
- 0692US7572673B2Wafer level package having a stress relief spacer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 11, 2009·18 cites·14 claims
- 0792US6399716B2Copolyester resin composition and a process of preparation thereofIRE CHEMICAL LTD·Filed 2000·Granted Jun 4, 2002·51 cites·17 claims
- 0891US9412707B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 9, 2016·8 cites·19 claims
- 0991US8735276B2Semiconductor packages and methods of manufacturing the sameCHUNG HYUN-SOO·Filed 2012·Granted May 27, 2014·14 cites·20 claims
- 1089US10840159B2Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection padSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 17, 2020·5 cites·16 claims
- 1189US10438899B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·5 cites·18 claims
- 1288US8637989B2Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2012·Granted Jan 28, 2014·9 cites·5 claims
- 1385US8426252B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2012·Granted Apr 23, 2013·5 cites·16 claims
- 1485US7205660B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 17, 2007·12 cites·10 claims
- 1584US7777345B2Semiconductor device having through electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·12 cites·12 claims
- 1682US7545027B2Wafer level package having redistribution interconnection layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 9, 2009·11 cites·22 claims
- 1781US11768558B2Touch sensing circuit and its method for sensing multi-frequency signalsLX SEMICON CO LTD·Filed 2021·Granted Sep 26, 2023·1 cites·13 claims
- 1881US7838992B2Wafer level package having a stress relief spacer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 23, 2010·6 cites·22 claims
- 1980US9698051B2Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 4, 2017·3 cites·19 claims
- 2080US7626260B2Stack-type semiconductor device having cooling path on its bottom surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 1, 2009·9 cites·15 claims
- 2179US12237309B2Semiconductor package having pads with stepped structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 25, 2025·0 cites·20 claims
- 2277US7544538B2Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 9, 2009·6 cites·15 claims
- 2376US7312143B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 25, 2007·6 cites·10 claims
- 2476US6280350B1Golf teeIRE CHEMICAL LTD·Filed 2000·Granted Aug 28, 2001·26 cites·3 claims
- 2575US7592709B2Board on chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 22, 2009·5 cites·15 claims
- 2674US11955464B2Semiconductor package having pads with stepped structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 2774US7830017B2Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 9, 2010·6 cites·13 claims
- 2873US11031347B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·20 claims
- 2972US11705376B2Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 3072US7897511B2Wafer-level stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·4 cites·30 claims
- 3172US6063895APolyester resin and a process for preparing the sameIRE CHEMICAL LTD·Filed 1999·Granted May 16, 2000·27 cites·16 claims
- 3270US8431479B2Semiconductor devices having redistribution structures and packages, and methods of forming the sameKIM KI-HYUK·Filed 2010·Granted Apr 30, 2013·4 cites·23 claims
- 3369US8110922B2Wafer level semiconductor module and method for manufacturing the sameCHUNG HYUN-SOO·Filed 2009·Granted Feb 7, 2012·3 cites·15 claims
- 3469US7847416B2Wafer level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Dec 7, 2010·3 cites·9 claims
- 3567US11574892B2Semiconductor package having pads with stepped structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 3667US11189535B2Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection padSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·17 claims
- 3767US8143693B2Semiconductor device including redistribution line structure and method of fabricating the sameBAEK SEUNG-DUK·Filed 2008·Granted Mar 27, 2012·4 cites·22 claims
- 3866US10930610B2Semiconductor chip including a bump structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·1 cites·20 claims
- 3966US8232644B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2012·Granted Jul 31, 2012·1 cites·29 claims
- 4066US8120177B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2010·Granted Feb 21, 2012·1 cites·28 claims
- 4166US2007184577A1Method of fabricating wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4264US8193637B2Semiconductor package and multi-chip package using the samePARK MYEONG-SOON·Filed 2008·Granted Jun 5, 2012·4 cites·25 claims
- 4364US8039937B2Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 18, 2011·2 cites·8 claims
- 4463US11029777B2Touch sensing device and display apparatus including the sameSILICON WORKS CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·20 claims
- 4562US8735281B2Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 27, 2014·1 cites·20 claims
- 4662US2025087603A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4761US12468408B2Active pen sensing device, a sensing driving method, and a display deviceLX SEMICON CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·18 claims
- 4860US7767576B2Wafer level package having floated metal line and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 3, 2010·1 cites·22 claims
- 4960US2024234376A9Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 5059US2024222273A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 93 patent records by PatentIndex Score.
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