Inventor
CHUN JIN-HO
KR13 patents
⚠️ This page may combine multiple inventors who share the name “CHUN JIN-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS9461007B2Oct 4, 2016
Wafer-to-wafer bonding structure
SAMSUNG ELECTRONICS CO LTD239 citations99
US9520361B2Dec 13, 2016
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD28 citations93
US8957526B2Feb 17, 2015
Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages
SAMSUNG ELECTRONICS CO LTD19 citations92
US10833032B2Nov 10, 2020
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US10580726B2Mar 3, 2020
Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations72
US10483224B2Nov 19, 2019
Semiconductor chip
SAMSUNG ELECTRONICS CO LTD1 citations72
US9698051B2Jul 4, 2017
Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages
SAMSUNG ELECTRONICS CO LTD3 citations72
US9691685B2Jun 27, 2017
Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations72
US11798906B2Oct 24, 2023
Semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations62
US11469202B2Oct 11, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations62
US11251144B2Feb 15, 2022
Semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations62
US8735281B2May 27, 2014
Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same
SAMSUNG ELECTRONICS CO LTD1 citations50