Inventor · disambiguated record
Tohru Kitano
Also filed as: KITANO TOHRU
8 granted patents·3 pending applications·7 citations·filing 2002–2022
77Inventor score
Top patents by PatentIndex Score
11 records- 0166US8168565B2Thermal recording adhesive labelKITANO TOHRU·Filed 2009·Granted May 1, 2012·1 cites·16 claims
- 0262US8367581B2Thermosensitive recording medium with antibacterial propertyRICOH CO LTD·Filed 2009·Granted Feb 5, 2013·0 cites·18 claims
- 0355US7811661B2Heat-sensitive adhesive materialRICOH KK·Filed 2005·Granted Oct 12, 2010·1 cites·27 claims
- 0451US2025050671A1Thermosensitive recording layer forming liquid, thermosensitive recording medium and production method thereof, and image recording methodMATSUI HIROAKI·Filed 2022·Application pending·0 cites
- 0547US8709974B2Thermosensitive recording mediumKITANO TOHRU·Filed 2011·Granted Apr 29, 2014·0 cites·12 claims
- 0645US11046043B2Linerless thermosensitive recording body packageKITANO TOHRU·Filed 2018·Granted Jun 29, 2021·0 cites·8 claims
- 0745US6847512B2Electrostatic breakdown prevention circuit for semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Jan 25, 2005·3 cites·6 claims
- 0843US6980409B2Protective circuit for semiconductor deviceMITSUBISHI ELECTRIC ENG·Filed 2004·Granted Dec 27, 2005·2 cites·4 claims
- 0940US2008070035A1Thermosensitive adhesive component, and thermosensitive adhesive label sheetKITANO TOHRU·Filed 2006·Application pending·0 cites
- 1037US10607509B2Linerless label and cutting apparatusODA YASUFUMI·Filed 2016·Granted Mar 31, 2020·0 cites·5 claims
- 1137US2006159913A1Heat-sensitive adhesive materialKUGO TOMOYUKI·Filed 2005·Application pending·0 cites
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