Inventor · disambiguated record
Akihiro Niimi
Also filed as: NIIMI AKIHIRO
6 granted patents·1 pending application·42 citations·filing 2004–2011
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0190US8421235B2Semiconductor device with heat spreadersIDE SHIGEO·Filed 2011·Granted Apr 16, 2013·21 cites·9 claims
- 0269US7009292B2Package type semiconductor deviceDENSO CORP·Filed 2004·Granted Mar 7, 2006·16 cites·15 claims
- 0364US7910460B2Metallic electrode forming method and semiconductor device having metallic electrodeDENSO CORP·Filed 2010·Granted Mar 22, 2011·2 cites·11 claims
- 0450US7193326B2Mold type semiconductor deviceDENSO CORP·Filed 2004·Granted Mar 20, 2007·3 cites·23 claims
- 0549US7468318B2Method for manufacturing mold type semiconductor deviceDENSO CORP·Filed 2007·Granted Dec 23, 2008·0 cites·5 claims
- 0648US7800232B2Metallic electrode forming method and semiconductor device having metallic electrodeDENSO CORP·Filed 2008·Granted Sep 21, 2010·0 cites·5 claims
- 0739US2005170555A1Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chipDENSO CORP·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →