Inventor · disambiguated record
Manabu Tomisaka
Also filed as: TOMISAKA MANABU
7 granted patents·5 pending applications·14 citations·filing 2003–2022
76Inventor score
Top patents by PatentIndex Score
12 records- 0172US7268008B2Method for manufacturing pressure sensorDENSO CORP·Filed 2006·Granted Sep 11, 2007·6 cites·23 claims
- 0271US7036384B2Pressure sensorDENSO CORP·Filed 2005·Granted May 2, 2006·6 cites·9 claims
- 0364US7910460B2Metallic electrode forming method and semiconductor device having metallic electrodeDENSO CORP·Filed 2010·Granted Mar 22, 2011·2 cites·11 claims
- 0459US12417909B2Surface processing apparatus and surface processing method for SiC substrateDENSO CORP·Filed 2022·Granted Sep 16, 2025·0 cites·8 claims
- 0548US7800232B2Metallic electrode forming method and semiconductor device having metallic electrodeDENSO CORP·Filed 2008·Granted Sep 21, 2010·0 cites·5 claims
- 0643US2017327943A1Coating structure, heat exchanger, and method for manufacturing heat exchangerDENSO CORP·Filed 2015·Application pending·0 cites
- 0742US2010288636A1Laminated gas sensor and method of producing the sameDENSO CORP·Filed 2010·Application pending·0 cites
- 0841US2015048510A1Semiconductor deviceDENSO CORP·Filed 2013·Application pending·0 cites
- 0934US2003221969A1Method for filling blind via holesFiled 2003·Application pending·0 cites
- 1029US2011207264A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2010·Application pending·0 cites
- 1128US8405218B2Semiconductor device and method of patterning resin insulation layer on substrate of the sameTOMISAKA MANABU·Filed 2010·Granted Mar 26, 2013·0 cites·8 claims
- 1224US8263490B2Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatusTOMISAKA MANABU·Filed 2010·Granted Sep 11, 2012·0 cites·10 claims
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