Inventor · disambiguated record
Hideko Fukushima
Also filed as: FUKUSHIMA HIDEKO
16 granted patents·2 pending applications·210 citations·filing 1987–2015
93Inventor score
Top patents by PatentIndex Score
18 records- 0196US7851055B2High-thermal-conductivity graphite-particles-dispersed-composite and its production methodHITACHI METALS LTD·Filed 2005·Granted Dec 14, 2010·23 cites·17 claims
- 0285US6362120B1Alumina ceramic compositionHITACHI METALS LTD·Filed 2000·Granted Mar 26, 2002·26 cites·15 claims
- 0384US5457075ASintered ceramic composite and molten metal contact member produced therefromHITACHI METALS LTD·Filed 1994·Granted Oct 10, 1995·41 cites·11 claims
- 0472US9276123B2Oxide semiconductor target and oxide semiconductor material, as well as semiconductor device using the sameHITACHI METALS LTD·Filed 2013·Granted Mar 1, 2016·2 cites·8 claims
- 0571US7282265B2Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methodsHITACHI METALS LTD·Filed 2004·Granted Oct 16, 2007·13 cites·10 claims
- 0670US6705860B2Setter for burningHITACHI METALS LTD·Filed 2001·Granted Mar 16, 2004·10 cites·14 claims
- 0770US6045893AMultilayered electronic part with minimum silver diffusionHITACHI METALS LTD·Filed 1998·Granted Apr 4, 2000·39 cites·14 claims
- 0869US9839957B2Ceramic core, manufacturing method for the same, manufacturing method for casting using the ceramic core, and casting manufactured by the methodHITACHI METALS LTD·Filed 2014·Granted Dec 12, 2017·1 cites·4 claims
- 0969US7923103B2Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methodsHITACHI METALS LTD·Filed 2007·Granted Apr 12, 2011·3 cites·10 claims
- 1068US7708050B2Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methodsHITACHI METALS LTD·Filed 2007·Granted May 4, 2010·3 cites·20 claims
- 1167US6221271B1Piezoelectric sintered ceramics and piezoelectric ceramic elements constituted therebyHITACHI METALS LTD·Filed 1999·Granted Apr 24, 2001·22 cites·16 claims
- 1257US5096863ADiffusion-bonded assembly of AlN ceramic bodies and heat dissipation member constituted therebyHITACHI METALS LTD·Filed 1991·Granted Mar 17, 1992·13 cites·9 claims
- 1349US9837543B2Oxide semiconductor target, oxide semiconductor film and method for producing same, and thin film transistorHITACHI METALS LTD·Filed 2014·Granted Dec 5, 2017·0 cites·6 claims
- 1449US2009197757A1Zinc oxide ceramics and a manufacturing method for the same, a sputtering targetHITACHI METALS LTD·Filed 2007·Application pending·0 cites
- 1547US9539639B2Ceramic core and method for producing sameFUKUSHIMA HIDEKO·Filed 2012·Granted Jan 10, 2017·0 cites·6 claims
- 1647US5077244AAluminum nitride sintered body and semiconductor substrate thereofHITACHI METALS LTD·Filed 1987·Granted Dec 31, 1991·14 cites·8 claims
- 1737US2010330738A1Oxide semiconductor target and manufacturing method of oxide semiconductor device by using the sameHITACHI METALS LTD·Filed 2010·Application pending·0 cites
- 1836US10040116B2Method of manufacturing ceramic sintered body and ceramic sintered bodyHITACHI METALS LTD·Filed 2015·Granted Aug 7, 2018·0 cites·4 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →