Inventor · disambiguated record
Hamid Eslampour
Also filed as: ESLAMPOUR HAMID · ESLAMPOUR HAMID R
12 granted patents·9 pending applications·75 citations·filing 2000–2025
90Inventor score
Top patents by PatentIndex Score
21 records- 0182US7401986B2Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuitINTEL CORP·Filed 2006·Granted Jul 22, 2008·9 cites·19 claims
- 0273US8057108B2Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuitBHOWMIK ACHINTYA K·Filed 2010·Granted Nov 15, 2011·3 cites·13 claims
- 0372US7780360B2Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuitINTEL CORP·Filed 2008·Granted Aug 24, 2010·4 cites·22 claims
- 0471US7050682B2Measuring the position of passively aligned optical componentsINTEL CORP·Filed 2005·Granted May 23, 2006·3 cites·5 claims
- 0571US6495462B1Components with releasable leadsTESSERA INC·Filed 2000·Granted Dec 17, 2002·18 cites·19 claims
- 0669US6527163B1Methods of making bondable contacts and a tool for making such contactsTESSERA INC·Filed 2000·Granted Mar 4, 2003·17 cites·27 claims
- 0768US7099360B2Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuitINTEL CORP·Filed 2003·Granted Aug 29, 2006·12 cites·17 claims
- 0863US2025199255A1Semiconductor package with optical bridge and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0961US8409921B2Integrated circuit package system including honeycomb moldingKUAN HEAP HOE·Filed 2010·Granted Apr 2, 2013·1 cites·20 claims
- 1061US2025046775A1Remapping layers for photonic interposersLIGHTMATTER INC·Filed 2024·Application pending·0 cites
- 1160US7260296B2Measuring the position of passively aligned optical componentsINTEL CORP·Filed 2006·Granted Aug 21, 2007·1 cites·4 claims
- 1257US11834328B2Semiconductor package with built-in vibration isolation, thermal stability, and connector decouplingINVENSENSE INC·Filed 2021·Granted Dec 5, 2023·0 cites·21 claims
- 1355US2024178923A1Photonic programmable interconnect configurationsLIGHTMATTER INC·Filed 2023·Application pending·0 cites
- 1454US6959134B2Measuring the position of passively aligned optical componentsINTEL CORP·Filed 2003·Granted Oct 25, 2005·2 cites·6 claims
- 1552US2009226135A1Measureing the position of passively aligned optical componentsTRAN UT·Filed 2009·Application pending·0 cites
- 1651US7040012B2Method of electrically and mechanically connecting electronic devices to one anotherINTEL CORP·Filed 2003·Granted May 9, 2006·5 cites·20 claims
- 1750US2022374575A1Electronic-photonic processors and related packagesLIGHTMATTER INC·Filed 2022·Application pending·0 cites
- 1850US2007274640A1Measuring the position of passively aligned optical componentsTRAN UT·Filed 2007·Application pending·0 cites
- 1949US2025291136A1System and methods for integrated epic architectureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2048US2025385147A1Semiconductor device including hybrid diamond thermal interposerSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2139US2006273454A1Locking mechanism for die assemblyLU DAOGIANG·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →