Inventor · disambiguated record
James Warren Wilson
Also filed as: WILSON JAMES · WILSON JAMES W · WILSON JAMES WARREN
39 granted patents·1 pending application·1,776 citations·filing 1984–2004
98Inventor score
Files withIBM40
Top patents by PatentIndex Score
40 records- 0198US6919514B2Structure having laser ablated features and method of fabricatingIBM·Filed 2003·Granted Jul 19, 2005·157 cites·12 claims
- 0298US6730857B2Structure having laser ablated features and method of fabricatingIBM·Filed 2001·Granted May 4, 2004·188 cites·9 claims
- 0397US4885074APlasma reactor having segmented electrodesIBM·Filed 1989·Granted Dec 5, 1989·110 cites·12 claims
- 0492US6900545B1Variable thickness pads on a substrate surfaceIBM·Filed 2000·Granted May 31, 2005·48 cites·14 claims
- 0592US5798563APolytetrafluoroethylene thin film chip carrierIBM·Filed 1997·Granted Aug 25, 1998·112 cites·22 claims
- 0692US5616958AElectronic packageIBM·Filed 1995·Granted Apr 1, 1997·122 cites·23 claims
- 0792US4508612AShield for improved magnetron sputter deposition into surface recessesIBM·Filed 1984·Granted Apr 2, 1985·41 cites·18 claims
- 0889US6569711B1Methods and apparatus for balancing differences in thermal expansion in electronic packagingIBM·Filed 2000·Granted May 27, 2003·53 cites·7 claims
- 0989US5572405AThermally enhanced ball grid array packageIBM·Filed 1995·Granted Nov 5, 1996·98 cites·10 claims
- 1089US5249101AChip carrier with protective coating for circuitized surfaceIBM·Filed 1992·Granted Sep 28, 1993·134 cites·5 claims
- 1184US6291779B1Fine pitch circuitization with filled plated through holesIBM·Filed 1999·Granted Sep 18, 2001·52 cites·17 claims
- 1282US5956235AMethod and apparatus for flexibly connecting electronic devicesIBM·Filed 1998·Granted Sep 21, 1999·67 cites·19 claims
- 1381US5939783AElectronic packageIBM·Filed 1998·Granted Aug 17, 1999·68 cites·15 claims
- 1477US5751060AElectronic packageIBM·Filed 1997·Granted May 12, 1998·43 cites·17 claims
- 1576US6618940B2Fine pitch circuitization with filled plated through holesIBM·Filed 2001·Granted Sep 16, 2003·19 cites·13 claims
- 1676US6077766AVariable thickness pads on a substrate surfaceIBM·Filed 1999·Granted Jun 20, 2000·29 cites·13 claims
- 1775US6177728B1Integrated circuit chip device having balanced thermal expansionIBM·Filed 1998·Granted Jan 23, 2001·41 cites·16 claims
- 1874US6259037B1Polytetrafluoroethylene thin film chip carrierIBM·Filed 1999·Granted Jul 10, 2001·35 cites·12 claims
- 1974US6150716AMetal substrate having an IC chip and carrier mountingIBM·Filed 1997·Granted Nov 21, 2000·30 cites·17 claims
- 2073US5728606AElectronic PackageIBM·Filed 1996·Granted Mar 17, 1998·35 cites·8 claims
- 2171US5561322ASemiconductor chip package with enhanced thermal conductivityIBM·Filed 1994·Granted Oct 1, 1996·35 cites·14 claims
- 2268US5661089AMethod for making a semiconductor chip package with enhanced thermal conductivityIBM·Filed 1996·Granted Aug 26, 1997·28 cites·14 claims
- 2367US5747877ASemiconductor chip package with enhanced thermal conductivityIBM·Filed 1996·Granted May 5, 1998·27 cites·14 claims
- 2466US6739048B2Process of fabricating a circuitized structureIBM·Filed 2000·Granted May 25, 2004·12 cites·5 claims
- 2566US6006428APolytetrafluoroethylene thin film chip carrierIBM·Filed 1998·Granted Dec 28, 1999·25 cites·7 claims
- 2665US6989297B2Variable thickness pads on a substrate surfaceIBM·Filed 2004·Granted Jan 24, 2006·8 cites·4 claims
- 2765US6059579ASemiconductor structure interconnector and assemblyIBM·Filed 1997·Granted May 9, 2000·25 cites·15 claims
- 2861US5390082AChip carrier with protective coating for circuitized surfaceIBM·Filed 1993·Granted Feb 14, 1995·36 cites·6 claims
- 2960US6013417AProcess for fabricating circuitry on substrates having plated through-holesIBM·Filed 1998·Granted Jan 11, 2000·21 cites·9 claims
- 3059US6841228B2Structure having embedded flush circuitry features and method of fabricatingIBM·Filed 2003·Granted Jan 11, 2005·6 cites·8 claims
- 3156US5768774AThermally enhanced ball grid array packageIBM·Filed 1996·Granted Jun 23, 1998·19 cites·6 claims
- 3251US6131279AIntegrated manufacturing packaging processIBM·Filed 1998·Granted Oct 17, 2000·14 cites·22 claims
- 3351US5966803ABall grid array having no through holes or via interconnectionsIBM·Filed 1997·Granted Oct 19, 1999·17 cites·19 claims
- 3445US6663786B2Structure having embedded flush circuitry features and method of fabricatingIBM·Filed 2001·Granted Dec 16, 2003·1 cites·22 claims
- 3543US6027858AProcess for tenting PTH's with PID dry filmIBM·Filed 1997·Granted Feb 22, 2000·11 cites·23 claims
- 3641US6455139B2Process for reducing extraneous metal platingIBM·Filed 2001·Granted Sep 24, 2002·0 cites·20 claims
- 3741US6131278AMetal substrate having an IC chip and carrier mountingIBM·Filed 1999·Granted Oct 17, 2000·7 cites·10 claims
- 3833US2001016462A1Wire bonding method and apparatusIBM·Filed 2001·Application pending·0 cites
- 3931US6296897B1Process for reducing extraneous metal platingIBM·Filed 1998·Granted Oct 2, 2001·1 cites·20 claims
- 4026US6488198B1Wire bonding method and apparatusIBM·Filed 1999·Granted Dec 3, 2002·1 cites·3 claims
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