Inventor · disambiguated record
Meng-Hsiu Hsieh
Also filed as: HSIEH MENG-HSIU
7 granted patents·4 pending applications·0 citations·filing 2009–2025
70Inventor score
Top patents by PatentIndex Score
11 records- 0181US2025329678A1Chip structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0275US12417992B2Chip structure with conductive pillar and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 0372US2025329536A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0469US11688708B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 0565US12412746B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0650US10757806B2Ceramic circuit plate and method of making sameHSIEH MENG-HSIU·Filed 2019·Granted Aug 25, 2020·0 cites·7 claims
- 0747US10234218B2Ceramic heat sink and method of making the sameHSIEH MENG HSIU·Filed 2017·Granted Mar 19, 2019·0 cites·9 claims
- 0846US10506711B2Ceramic circuit plate and method of making sameHSIEH MENG HSIU·Filed 2018·Granted Dec 10, 2019·0 cites·6 claims
- 0946US10455852B2Rapid defrosting trayHSIEH MENG HSIU·Filed 2016·Granted Oct 29, 2019·0 cites·6 claims
- 1044US2019301155A1Dropped ceiling with eco-friendly ceiling panelsHSIEH MENG HSIU·Filed 2019·Application pending·0 cites
- 1140US2011061847A1Heat dissipation deviceHSIEH MENG-HSIU·Filed 2009·Application pending·0 cites
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