Inventor · disambiguated record
Chong J. Zhao
Also filed as: ZHAO CHONG · ZHAO CHONG J
12 granted patents·7 pending applications·27 citations·filing 2011–2025
86Inventor score
Top patents by PatentIndex Score
19 records- 0194US11776619B2Techniques to couple high bandwidth memory device on silicon substrate and package substrateTAHOE RES LTD·Filed 2023·Granted Oct 3, 2023·1 cites·20 claims
- 0294US10146711B2Techniques to access or operate a dual in-line memory module via multiple data channelsINTEL CORP·Filed 2016·Granted Dec 4, 2018·14 cites·27 claims
- 0387US9832876B2CPU package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2014·Granted Nov 28, 2017·7 cites·36 claims
- 0487US2025006250A1Techniques to couple high bandwidth memory device on silicon substrate and package substrateTAHOE RES LTD·Filed 2024·Application pending·0 cites
- 0585US12087352B2Techniques to couple high bandwidth memory device on silicon substrate and package substrateTAHOE RES LTD·Filed 2023·Granted Sep 10, 2024·0 cites·18 claims
- 0682US11056179B2Techniques to couple high bandwidth memory device on silicon substrate and package substrateINTEL CORP·Filed 2020·Granted Jul 6, 2021·1 cites·16 claims
- 0778US2025349327A1Stacked memory chip solution with reduced package inputs/outputs (i/os)INTEL CORP·Filed 2025·Application pending·0 cites
- 0877US10884958B2DIMM for a high bandwidth memory channelINTEL CORP·Filed 2018·Granted Jan 5, 2021·2 cites·18 claims
- 0971US11557333B2Techniques to couple high bandwidth memory device on silicon substrate and package substrateTAHOE RES LTD·Filed 2021·Granted Jan 17, 2023·0 cites·18 claims
- 1071US10592445B2Techniques to access or operate a dual in-line memory module via multiple data channelsINTEL CORP·Filed 2018·Granted Mar 17, 2020·2 cites·31 claims
- 1164US12340863B2Stacked memory chip solution with reduced package inputs/outputs (I/Os)INTEL CORP·Filed 2021·Granted Jun 24, 2025·0 cites·19 claims
- 1251US12073906B2Package pin pattern for device-to-device connectionINTEL CORP·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 1350US2023030614A1Light emitting assembly, time of flight camera module, and mobile terminalHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 1449US2018007791A1Cpu package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2017·Application pending·0 cites
- 1548US11569161B2Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speedsINTEL CORP·Filed 2019·Granted Jan 31, 2023·0 cites·8 claims
- 1646US11621237B2Interposer and electronic packageINTEL CORP·Filed 2019·Granted Apr 4, 2023·0 cites·23 claims
- 1746US2024421025A1Enhanced i/o semiconductor chip package and cooling assembly having side i/osINTEL CORP·Filed 2021·Application pending·0 cites
- 1844US2015171535A1Memory connector for two sodimm per channel configurationLI XIANG·Filed 2011·Application pending·0 cites
- 1944US2019042162A1Back-end memory channel that resides between first and second dimm slots and applications thereofINTEL CORP·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →