Inventor · disambiguated record
Joerg Siegert
Also filed as: SIEGERT JOERG
15 granted patents·1 pending application·16 citations·filing 2013–2020
87Inventor score
Top patents by PatentIndex Score
16 records- 0185US9852955B2Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor componentAMS AG·Filed 2016·Granted Dec 26, 2017·6 cites·21 claims
- 0273US10684412B2Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor deviceAMS AG·Filed 2016·Granted Jun 16, 2020·2 cites·16 claims
- 0373US10283541B2Semiconductor device comprising an aperture array and method of producing such a semiconductor deviceAMS AG·Filed 2015·Granted May 7, 2019·2 cites·27 claims
- 0471US9753218B2Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirrorAMS AG·Filed 2014·Granted Sep 5, 2017·3 cites·13 claims
- 0566US11107848B2Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiationAMS AG·Filed 2014·Granted Aug 31, 2021·2 cites·2 claims
- 0662US11313749B2Pressure sensor device and method for forming a pressure sensor deviceSCIOSENSE BV·Filed 2017·Granted Apr 26, 2022·0 cites·9 claims
- 0762US9929035B2Method of producing a removable wafer connection and carrier for wafer supportAMS AG·Filed 2013·Granted Mar 27, 2018·1 cites·4 claims
- 0859US11697201B2Exoskeleton system, control device, and methodUNIV STUTTGART·Filed 2020·Granted Jul 11, 2023·0 cites·22 claims
- 0952US10332931B2Semiconductor device for wafer-scale integrationAMS AG·Filed 2017·Granted Jun 25, 2019·0 cites·5 claims
- 1052US9608035B2Method of wafer-scale integration of semiconductor devices and semiconductor deviceAMS AG·Filed 2013·Granted Mar 28, 2017·0 cites·5 claims
- 1150US9991177B2Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor componentAMS AG·Filed 2017·Granted Jun 5, 2018·0 cites·3 claims
- 1246US12100644B2Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate viaAMS AG·Filed 2019·Granted Sep 24, 2024·0 cites·15 claims
- 1344US10644047B2Optoelectronic device with a refractive element and a method of producing such an optoelectronic deviceAMS AG·Filed 2016·Granted May 5, 2020·0 cites·17 claims
- 1443US2015340264A1Method of application of a carrier to a device waferAMS AG·Filed 2014·Application pending·0 cites
- 1542US11271134B2Method for manufacturing an optical sensor and optical sensorAMS AG·Filed 2018·Granted Mar 8, 2022·0 cites·10 claims
- 1639US11572271B2Method for manufacturing an etch stop layer and MEMS sensor comprising an etch stop layerAMS AG·Filed 2019·Granted Feb 7, 2023·0 cites·14 claims
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