Inventor · disambiguated record
Kenichi Watatani
Also filed as: WATATANI KENICHI
16 granted patents·5 pending applications·21 citations·filing 2001–2019
88Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES17MISHIMA HIDEHIKO1MITSUI MINING & SMELTING CO LTD1NIKKO MATERIALS CO LTD1WATATANI KENICHI1
Top patents by PatentIndex Score
21 records- 0189US9957604B2Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted May 1, 2018·6 cites·7 claims
- 0286US10475631B2Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Nov 12, 2019·3 cites·2 claims
- 0383US10087517B2Oxide sintered body and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Oct 2, 2018·4 cites·7 claims
- 0482US10655213B2Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted May 19, 2020·2 cites·4 claims
- 0580US7807942B2Laser processing method and laser processing apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Oct 5, 2010·6 cites·17 claims
- 0655US10480060B2Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Nov 19, 2019·0 cites·7 claims
- 0753US10811238B2Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Oct 20, 2020·0 cites·6 claims
- 0849US9187376B2Sintered compact, cutting tool formed using sintered compact, and method for manufacturing sintered compactSUMITOMO ELECTRIC INDUSTRIES·Filed 2012·Granted Nov 17, 2015·0 cites·10 claims
- 0949US6745092B2Product management system, and host computer and recorded medium used in the systemNIKKO MATERIALS CO LTD·Filed 2001·Granted Jun 1, 2004·0 cites·11 claims
- 1048US10822276B2Oxide sintered material and method of manufacturing the same, sputtering target, and method of manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Nov 3, 2020·0 cites·14 claims
- 1146US8338744B2Condensing optical system, laser processing method and apparatus, and manufacturing method of brittle material blankWATATANI KENICHI·Filed 2007·Granted Dec 25, 2012·0 cites·13 claims
- 1245US10894744B2Oxide sintered material and method for manufacturing the same, sputtering target, and method for manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Jan 19, 2021·0 cites·10 claims
- 1343US2017222058A1Semiconductor device and method for manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 1442US10192994B2Oxide semiconductor film including indium, tungsten and zinc and thin film transistor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Jan 29, 2019·0 cites·8 claims
- 1541US11616148B2Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor deviceMITSUI MINING & SMELTING CO LTD·Filed 2017·Granted Mar 28, 2023·0 cites·12 claims
- 1640US11492694B2Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Nov 8, 2022·0 cites·3 claims
- 1740US11024744B2Semiconductor device and method for manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Jun 1, 2021·0 cites·20 claims
- 1839US2009152246A1Method for Processing Material by Laser Ablation and Material Processed by Processing Method ThereofMISHIMA HIDEHIKO·Filed 2006·Application pending·0 cites
- 1935US2019140104A1Semiconductor device and method for manufacturing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Application pending·0 cites
- 2035US2020126790A1Oxide sintered material and method of manufacturing the same, sputtering target, oxide semiconductor film, and method of manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Application pending·0 cites
- 2132US2016251264A1Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Application pending·0 cites
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