Inventor · disambiguated record
Chia-Chun Miao
Also filed as: MIAO CHIA-CHUN
43 granted patents·4 pending applications·91 citations·filing 2012–2024
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD25OMNIVISION TECH INC12TAIWAN SEMICONDUCTOR MFG5ADVANCED MICRO DEVICES INC3LIANG SHIH-WEI1
Top patents by PatentIndex Score
47 records- 0196US9590005B1High dynamic range image sensor with reduced sensitivity to high intensity lightOMNIVISION TECH INC·Filed 2016·Granted Mar 7, 2017·14 cites·11 claims
- 0294US9543373B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·15 cites·20 claims
- 0393US9337154B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·14 cites·20 claims
- 0488US10892290B2Interconnect layer contact and method for improved packaged integrated circuit reliabilityOMNIVISION TECH INC·Filed 2018·Granted Jan 12, 2021·5 cites·11 claims
- 0586US10418408B1Curved image sensor using thermal plastic substrate materialOMNIVISION TECH INC·Filed 2018·Granted Sep 17, 2019·4 cites·16 claims
- 0686US9806045B2Interconnection structure including a metal post encapsulated by solder joint having a concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 31, 2017·6 cites·20 claims
- 0786US9698079B2Barrier structures between external electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 4, 2017·5 cites·20 claims
- 0885US9608023B1Edge reflection reductionOMNIVISION TECH INC·Filed 2016·Granted Mar 28, 2017·3 cites·7 claims
- 0982US10157900B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
- 1082US9966396B2High dynamic range image sensor with reduced sensitivity to high intensity lightOMNIVISION TECH INC·Filed 2016·Granted May 8, 2018·3 cites·9 claims
- 1181US9559071B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·18 claims
- 1278US11101238B2Surface mounting semiconductor componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·2 cites·20 claims
- 1376US12218035B2Barrier structures between external electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1476US9921442B2Method for forming an alignment layer of a liquid crystal display device and display device manufactured therebyOMNIVISION TECH INC·Filed 2016·Granted Mar 20, 2018·1 cites·24 claims
- 1576US9263405B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·3 cites·20 claims
- 1674US9064873B2Singulated semiconductor structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 23, 2015·3 cites·20 claims
- 1770US11894330B2Methods of manufacturing a semiconductor device including a joint adjacent to a postTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 1869US10297627B1Chip scale package for an image sensorOMNIVISION TECH INC·Filed 2017·Granted May 21, 2019·1 cites·14 claims
- 1968US10049990B2Solder ball protection in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 14, 2018·1 cites·20 claims
- 2065US10985117B2Solder ball protection in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 2164US9941240B2Semiconductor chip scale package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 10, 2018·1 cites·18 claims
- 2264US9460989B2Interposer having a defined through via patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 4, 2016·1 cites·20 claims
- 2363US11296012B2Barrier structures between external electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·0 cites·20 claims
- 2462US8664768B2Interposer having a defined through via patternLIANG SHIH-WEI·Filed 2012·Granted Mar 4, 2014·1 cites·20 claims
- 2561US10510689B2Solder ball protection in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2661US10211243B2Edge reflection reductionOMNIVISION TECH INC·Filed 2018·Granted Feb 19, 2019·0 cites·5 claims
- 2761US10147751B2Edge reflection reductionOMNIVISION TECH INC·Filed 2018·Granted Dec 4, 2018·0 cites·8 claims
- 2860US10720495B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 21, 2020·1 cites·20 claims
- 2959US10867957B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 3059US2025357365A1Chip package assembly with surface mounted component protectionADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 3158US10347563B2Barrier structures between external electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 9, 2019·0 cites·20 claims
- 3258US9966404B2Edge reflection reductionOMNIVISION TECH INC·Filed 2017·Granted May 8, 2018·0 cites·5 claims
- 3357US9184143B2Semiconductor device with bump adjustment and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 10, 2015·0 cites·20 claims
- 3457US2025157864A1Integrated circuit device with raised lid attach areaADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3556US10971463B2Interconnection structure including a metal post encapsulated by a joint material having concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 6, 2021·0 cites·20 claims
- 3656US9472523B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 18, 2016·0 cites·19 claims
- 3755US10761385B2Liquid crystal on silicon panel having less diffractionZHANG MING·Filed 2017·Granted Sep 1, 2020·0 cites·6 claims
- 3855US10163846B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 3955US2025006496A1Removing conductive material from a pedestal of a semiconductor lid outside of an area contacting a dieADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 4054US10037959B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·0 cites·20 claims
- 4153US11195864B2Flip-chip sample imaging devices with self-aligning lidOMNIVISION TECH INC·Filed 2019·Granted Dec 7, 2021·0 cites·19 claims
- 4252US9355924B2Integrated circuit underfill schemeTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 31, 2016·0 cites·14 claims
- 4351US9953966B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·0 cites·20 claims
- 4449US10269588B2Integrated circuit underfill schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·0 cites·20 claims
- 4547US9653341B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·0 cites·20 claims
- 4643US9627325B2Package alignment structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 18, 2017·0 cites·16 claims
- 4737US2017162621A1Light channels with multi-step etchOMNIVISION TECH INC·Filed 2015·Application pending·0 cites
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